Loyalty Founder Enterprise Co. Ltd. (LFE, Taiwan) announced the availability of its H101 3U/4U Camel Series of copper heatsinks. Measuring 89.9mm x...
Vishay Intertechnology Inc. (Malvern, PA) announced the availability of more than 120 diode devices in the SMF (DO219-AB) package, which combines high power capability and miniaturized dimensions of 3.7mm x 1.8mm x 0.98mm to allow considerable space savings on printed circuit boards. The SMF (DO219-AB) package meets the demand for smaller and thinner diodes that […]
Xinruilian Electronics Co. Ltd. (China) announced its XRL-HS-565 60mm to 80mm, high-static-pressure, cooling fan that has a rated voltage of 12Vdc and...
NEC Corp. (Tokyo, Japan) has developed what it claims is the world's first slim-sized, water-cooling module for notebook personal computers that employs a piezoelectric pump driving method. The water-cooling module is developed by integrating the pump and the tank with the aluminum radiation plate that contains the water circulation channel. Through the design of the […]
Royal Philips Electronics (Eindhoven, the Netherlands) announced a new generation of small, discrete, leadless packages using quad-flat nonleaded (QFN) technology. The new SOT88x package family are suitable for applications such as LCD back-light-related devices, dc/dc conversion, electro-static discharge protection devices and small-signal switching transistors. With dimensions of 1mm x 0.6mm x 0.5mm and bottom contact […]
Global Win Tech Co. Ltd. (Taiwan) announced its new WE482 cooling fan that supports up to Pentium 4 3.06GHz, and features a...
ON Semiconductor Corp. (Phoenix, AZ) added the SOD-123FL package to its portfolio of discrete components. Fifty devices, including transient voltage suppression (TVS) components and Schottky diodes, are now available in the low-profile, flat-lead package. Additional devices will become available in the new packaging later this year. The devices are suitable for board-space-conscious portable applications. The […]
NMB Minebea GmbH (UK) announced that it has added a cost-effective, 101mm, radial blower to its comprehensive product range. With dimensions of...
ChipPAC Inc. (Fremont, CA) announced that it is ready to produce a 10mm x 14mm x 1.2mm, four-chip, stacked package, what it claims is the world's thinnest. The company's previous-generation thin package had a height of 1.4mm. The new package can house four different types of semiconductors, including ASIC and memory chips, in addition to […]
Royal Philips Electronics (Eindhoven, the Netherlands) announced its new small logic, integrated circuit (IC), 24-pin, depopulated, quad flat-pack no-leads (DQFN) package, designed...
Furukawa Electric Co. Ltd. (Japan) announced the development of a sheet-type heatsink that the company claims is the world's smallest and enables...
Bi-Sonic Technology Corp. (Taiwan) announced the release of a CPU cooler that features a cooling fan that uses ventral fin blades, which...
Tsinghua Huatian Technology Development Co. Ltd. (THTD, China) announced its new AE-076 CPU cooler, which features an 80mm x 80mm x 25mm...
OSI Fibercomm (Hawthorne, CA) introduced four miniature packages for its InGaAs photodiodes for laser diode monitoring. With active area sizes of 120µm, 300µm, 400µm and 500µm, the photodiodes are low noise, have a high responsivity (1310nm to 1550nm) and operate in a spectral range from 900nm to 1,700nm. Applications include diode laser monitors, high-speed optical […]
Samsung Electronics Co. Ltd. (Seoul, Korea) announced mass production of a four-chip, multi-chip package (MCP) for mobile handsets. The company also announced a new integrated software system that greatly reduces the development time of MCP, system-in-package (SiP) and system-on-chip (SoC) designs by enabling simultaneous design of semiconductor circuits and packages. Samsung's MCP stacks four chips […]