Vishay Intertechnology Inc. (Malvern, PA) announced the availability of more than 120 diode devices in the SMF (DO219-AB) package, which combines high power capability and miniaturized dimensions of 3.7mm x 1.8mm x 0.98mm to allow considerable space savings on printed circuit boards. The SMF (DO219-AB) package meets the demand for smaller and thinner diodes that enable small and light portable products, such as cellular phones, notebook PCs and portable consumer products, as well as space-constrained automotive modules.
With its industry-low package height of 0.98mm, the SMF (DO219-AB) package reduces space requirements and improves circuit board density. Designers will use the SMF-packaged devices as drop-in replacements for the diodes in the SOD-123FL, SOD-87 and PowerMite. The SMF (DO219-AB) package can also be used to replace larger footprint devices such as the SMA and M1F with space savings up to 40%.
The SMF (DO219-AB) delivers enhanced performance in a lead-free package platform. It is 260°C reflow capable to Moisture Sensitivity Level (MSL) 1, and it is backward compatible with existing reflow processes. Samples and production quantities of the SMF (DO219-AB) packaged diodes are available now, with lead times of six to eight weeks for larger orders. Pricing for US delivery in 100,000-piece quantities starts at $5.60, $6.00 and $7.50 per 100 pieces, respectively, for switching, fast-switching, and ultra-fast-switching diodes; $7.40 per 100 pieces for zener diodes; $8.30 per 100 pieces for ESD protection diodes; and $9.50 per 100 pieces for schottky diodes.
