Fischer Electronik (Germany) is now offering heatsinks for surface-mount packages — D-PAK, TO-252 D-PAK, TO-263 D2PAK and TO-268 D3PAK. These heatsinks provide...
Thermacore International (Lancaster, PA) expanded its line of power semiconductor cooling solutions to include the new Therma-Fin folded-fin heat-sinks, which have been...
STMicroelectronics Inc. (Lexington, MA) introduced its latest generation of chip-scale packaging for power-integrated circuits as well as six n-channel MOSFETs that take advantage of the new package to slash size and weight while boosting thermal and electrical performance. The PowerFLAT case, available in 6mm x 5mm and 5mm x 5mm outlines, adopts a micro-lead-frame design […]
RF Connectors (San Diego, CA) introduced its new RSA-3000-I connector, which is part of the company's sub-miniature line of SMA, SMB, MB,...
Fischer Elektronik (Germany) is now offering connectors in 1.27mm, 2mm and 2.54mm modular sizes that can be customized to customer specifications. The...
JARO Components Inc. (Boca Raton, FL) announced the new HTP Series of water-condensing heat pipes designed to cool electronic components when space...
COSCO Aluminium Developments Co. Ltd. (China) reports that its new COSCO-7 extruded heatsinks offer increased heat-emissive area and heat-emissive coefficient. The heatsinks...
Chia Cherne Ind. Co. Ltd. (Taiwan) premiered the JAH11C Series of heatsinks designed for CPU coolers in 1U, 2U, slim PC and socket 370A/462 (active) units. The new heatsinks measure 60mm x 60mm, with a thickness of 11.5mm. Chia Cherne's new heatsinks are made of copper C1020. A stacked process has also been employed instead […]
Degree Controls Inc. (Milford, NH) announced the release of the customized Tortoise Back heatsink solution for dc/dc converters used in communications applications. "Given the extreme nature of thermal management issues that the communications industry faces, new designs that resolve specific thermal problems are in strong demand," said Sam Hopp, vice president of sales and marketing. […]
General Semiconductor (Melville, NY) announced a new SMF package that it claims offers the same current and power-handling capability of a power package in an ultra-small package. The SMF matches the JEDEC DO-219 standard outline, with a height of less than 1mm. The footprint allows it to fit on the mounting pad of a number […]
American Power Conversion (APC, West Kingston, RI) announced that it is expanding its availability solutions to include a new portable 7,200btu air-conditioning unit engineered to safeguard servers, PBXs, Internet-working hardware and sensitive office equipment from the disastrous effects of heat exposure. The new Network AIR 1000 provides supplemental, emergency or temporary cooling. The unit is […]
Aerco Ltd. (UK) introduced the new ABPC range of power connectors. The maximum current rating for the ABPC range is 100A and the operating temperature range is from -55 to 100 degrees C. The connectors are designed for use with single- and three-phase power supplies. The ABPC range of multicontact heavy-duty power connectors is approved […]
Alpha Co. Ltd. (Japan) announced its new UB Series of low-profile heatsinks for use in limited-space applications. The UB Series incorporates Alpha's...
RTP Co. (Winona, MN) announced that it is now offering a new line of flame-retardant, high-impact polystyrene (HIPS) thermoplastics. The company claims that these materials meet various flame ratings, provide excellent colorability and physical properties, and are fully recyclable. HIPS products can be customized to meet UL94V-o and V-2, and/or the IEC 695-2-1 glow wire […]
Dynex Semiconductor (UK) has released a compact IGBT module package designed for applications up to 3,300V, including traction auxiliaries and specialist motor drives. The new P package has a 6kV isolation rating and has baseplate dimensions of 140 x 73mm. The first product available using the P outline is the DIM200PHM33 Powerline 200A, 3,300V IGBT […]