American Power Conversion (APC, West Kingston, RI) announced the addition of a new compact air-distribution unit that gives IT, telecom and facility managers the ability to increase airflow inside racks and enclosures. APC's NetworkAIR RM Air-Distribution Unit works with the existing precision air-conditioning system to pull air from beneath the raised floor directly into the […]
Allegro MicroSystems Inc. (Worcester, MA) announced the release of its next-generation, hall-effect, sensor packaging technology. The new SE, SG and SH packages...
Royal Philips Electronics (Eindhoven, the Netherlands) introduced its new depopulated, very-thin, quad flat-pack, no-leads (DQFN) logic integrated circuit (IC) package, which enhances miniaturization of the circuit board and frees board space for additional components and functions. Designed with a footprint of 2.5mm x 3mm in a 14-pin configuration, the DQFN package is 75 percent smaller […]
TaiSol Electronics Co. Ltd. (China) announced its new CEP411090C heatsink, which features 10 aluminum-extruded fins, measures 37mm x 37mm x 20mm and...
Thermacore International Inc. (Lancaster, PA), a subsidiary of Modine Manufacturing Co., has expanded its line of thermal solutions to include a new...
NMB Minebea (UK) unveiled its new 250mmm backward-curved 250R100 radial blower, which is part of an extensive range of high-efficiency blowers specifically...
Dynaeon Ind. Co. Ltd. (Taiwan) introduced its new DF1204BA-3 cooling fans, designed for use in 1U rack-mount servers, which measure 40mm x...
Royal Philips Electronics (Eindhoven, the Netherlands) announced the launch of its Loss Free Package (LFPAK), claimed to be the world's first thermally and electrically enhanced version of the industry-standard SO8 package. The new semiconductor package offers improved power handling and thermal resistance by overcoming the thermal limitations of the SO8 package and enabling resistance comparable […]
Shenzhen Jieleng Ind. Development Co. Ltd. (China) announced the EC002 CPU cooler, which has a 50mm x 50mm x 30mm heatsink and...
Chromerics (Woburn, MA) introduced its new THERMFLOW T766 phase-change material, which provides a low thermal resistance path between hot components and heatsinks while allowing easy removal of sinks for reworking operations. The T766 pads include a foil layer that allows heatsinks to be removed without force and without leaving residue to be cleaned from component […]
Oriental Motor USA Corp. (Torrance, CA) announced that the MB Series of ac centrifugal blowers is now available in two new three-phase...
International Rectifier Corp.'s (Leominster, MA) Hi-Rel Component and Subsystems Group announced the addition of Omnirel DSCC-approved hermetic TO-204AA package offerings on nine...
Sprague-Goodman Electronics Inc. (Westbury, NY) announced that it is now offering silicon varactor diodes in a new surface-mount monolithic package (SMMP). The new package design approaches the size of a diode chip, yet can be handled using surface-mount technology. The package design uses photo-lithographic methods at wafer fabrication to connect to the diode. Since this […]
Thermacore International (Lancaster, PA) introduced its new Therma-Base vapor chamber heatsinks. The Therma-Base vapor chambers are plate-shaped heat pipes used as the...
General Semiconductor Inc. (Melville, NY) introduced a ultra-small leadless package that has been designed to meet the space and performance requirements for tomorrow's new electronic products. The initial version is a six-pin leadless package that meets the power-handling capability of an industry-standard SOT-23 with the footprint (1.6mm x 1.6mm) of a SC-75, which takes up […]