Trohito Electronic Co. Ltd. (Shenzhen, China) introduced the V155 CPU cooler, which provides an airflow of 27.21cfm, has a rated lifespan of...
Chomerics (Woburn, MA), a division of Parker Hannifin Corp., introduced its THERM-A-GAP T630 and T630G form-in-place, fully cured, thermally conductive, gap filler materials that provide a highly conformable thermal path between hot components and heat spreaders. The thermal gap fillers are designed to replace gap-filling elastomeric pads that may over-stress component solder joints and leads, […]
NMB Minebea GmbH (UK) announced its new dc blower, the BG1203, which delivers an airflow of up to 58,2m³/h and can operate...
Tsinghua Huatian Technology Development Co. Ltd. (China) announced its new AE-P406 CPU cooler, which provides an airflow of 18.2cfm and is designed...
ON Semiconductor LLC (Phoenix, AZ) introduced its new power integrated packaging (PInPAK™) proprietary packaging technology that is the platform for the NIS3001,...
STMicroelectronics Inc. (Geneva, Switzerland) introduced two new tiny packages in its portfolio, the MSOP8 and MLP8, which are targeted for use in consumer, computer, communications and industrial markets. The MSOP8, also called the TSSOP8 3×3 according to JEDEC standards, provides a 23-percent reduction in size compared to its predecessor, the TSSOP8. The MSOP8 measures 3mm […]
Fujipoly America Corp. (Carteret, NJ) announced its new Sarcon® SF-Nd phase-change interface materials for use in high-performance microprocessors requiring minimal thermal resistance...
Huatian Technology Development Co. Ltd. (Tsinghua, China) introduced its AE-085+ CPU cooler, which is designed for AMD Athlon XP processors and is...
Microchip Technology Inc. (Chandler, AZ) announced the expansion of the TC6xx family, with its single- and dual-SMBus fan speed controllers featuring fan-fault...
Xinruilian Electronics Co. Ltd. (Shenzhen, China) introduced its new RDH4028B brushless dc fan, which operates from a 3.5Vdc to 5Vdc source, produces...
Toshiba America Electronic Components Inc. (TAEC, Irvine, CA) announced a new eight-pin, surface-mount package for use as a power MOSFET. Developed by Toshiba Corp. (Japan), the VS-8 is suitable for power management switching and dc/dc conversion in portable computers, portable phones, personal digital assistants and other emerging applications where space is at a premium. The […]
Power Acumen (Stockton, CA) introduced its new FT3100 Series FlexTray, which are a series of dual-redundant, universal dc-input, fan trays with additional...
Royal Philips Electronics (Eindhoven, Netherlands) announced the introduction of a new range of power MOSFETs in miniature power packages. The new QLPAK...
NMB Minebea GmbH (UK) announced that it has added the 220R071 intelligent 220mm radial blower to its comprehensive product range, which is...
Tsinghua Huatian Technology Development Co. Ltd. (THTD, China) introduced its new AE-071+ CPU cooler, which operates from a 7Vdc supply, produces 30dB...