Unipower Corp. (Coral Springs, FL) announced a U-high PowerCassette rack that measures 19" and holds two of the new PowerCassette switching power supplies. With the two units in a 1+1 redundant, hot-swap configuration, the system produces up to 600W dc with up to six outputs. The PowerCassette's outputs are programmed at the factory to meet […]
Anderson Power Products (Sterling, MA) recently debuted the Powerclaw Series of hot-swappable high-amperage power connectors for PCBs. Providing N+1 redundancy for communications...
Nidec America Corp. (Canton, MA) debuted the new Widebody brushless dc cooling fans, which the company claims provides 17 percent more airflow...
Chomerics (Woburn, MA), a division of Parker Hannifin Corp. (Cleveland, OH), introduced PowerSite, an automated power semiconductor attachment technology. The PowerSite process...
Liebert Corp. (Columbus, OH) has introduced Foundation, a new integrated enclosure system designed to protect computer networking equipment. The Foundation Enclosure can be scaled up in features and level of protection from a rack enclosure to a fully integrated "mini computer room" system. The Foundation system comes in an array of sizes and enhancements to […]
Infineon Technologies (Germany) introduced a new packaging technology called the Thin Small Lead-less Package (TSLP). Infineon's TSLP is a plastic, lead-less, halogen-free package for discrete devices which, the company claims, consumes only 20 percent of the space of a standard SC-75 package. With an overall footprint of 1.0mm x 0.6mm x 0.4mm, the TSLP is […]
Schroff (UK) recently introduced the new Europac PRO system, which the company claims enables customers to achieve an optimum 19" subrack solution....
AVX Corp. (Myrtle Beach, SC) recently introduced PolyTect Soft Molding, an engineering-grade polymer for overmolding fully-populated printed circuit boards. AVX claims that PolyTect allows for a one-step process that molds a single piece, replacing the typical application consisting of a two-piece plastic housing and conventional potting. PolyTect Soft Molding can be used to protect fully-populated […]
International Rectifier (El Segundo, CA) now offers its POWIRTAB package for 30V input diodes. The POWIRTAB combines the current handling capability of...
Liebert Corp. (Columbus, OH) debuted the 10 Fan Drycooler, designed to provide heat rejection of 150 tons in a footprint of 123 square feet. Available as either 60Hz and 50Hz systems, Liebert claims that the 10 Fan Drycooler provides the cooling capacity of two conventional eight-fan drycoolers, with a space savings of 172 square feet, […]
Vicor Corp. (Andover, MA) announced SurfMate, a new surface-mount interface accessory suitable for use with pin-compatible second-generation dc/dc converters. SurfMate, the first in a family of ModuMate interconnect products, utilizes a pair of surface-mounted headers that contain sockets to accept the input and output pins of the converter module. The SurfMate header assembly is compatible […]
Molex Thermal Acoustic Products (Lisle, IL) announced its new radial-fin heatsink, which it claims will cool microprocessors faster and more quietly than...
IXYS Corp. (Santa Clara, CA) recently introduced the ISOPLUS247 plastic encapsulated package in the "hole-less" TO-246 outline with an electrically isolated mounting tab. The new package design replaces the standard copper lead frame with Direct-Copper-Bonded alumina, to which any discrete semiconductors, from diodes to MOSFETs to thyristors, can be soldered. The package can be mounted […]
IRC Inc. (Corpus Christi, TX) is employing its thick film-on-aluminum technology to manufacture electronic circuits with high-thermal transfer characteristics. The company claims...
International Rectifier (El Segundo, CA) introduced its new SMD-0.5 package, which is claimed to offer two times the power handling capability as...