Xanoptix Inc. (Merrimack, NH) introduced an "inside-out" heatsink that features a multitude of intersecting passageways that allows air or fluid to flow...
Molex Singapore Pte. Ltd. (Singapore) presented its 37256-000x Series of CPU coolers, which measure 62mm x 70mm x 48.6mm, have a copper...
Sunonwealth Electric Machine Ind. Co. Ltd. (Taiwan) announced the availability of its Mighty Mini Cooling Fan that measures 6mm x 6mm, making...
AVX Corp. (Myrtle Beach, SC) announced the development of advanced ferrite materials, the P1 and P2 Series, which are available in a...
Tsinghua Huatian Technology Development Co. Ltd. (Tsinghua, China) announced the new AE-079 CPU cooler that provides a maximum airflow of 21.19cfm, noise...
Thermal Integration Technology Inc. (TITI, Taiwan) unveiled its TI-M707L notebook CPU cooler that delivers an airflow of 37.54cfm and is designed for use in Pentium 4 processors that operate from 2GHz to 2.8GHz. The 92mm x 78.4mm x 43mm device weighs 363g and integrates a 70-fin heatsink. The device is rated at 12V and produces […]
STMicroelectronics Inc. (Geneva, Switzerland) introduced an ultra-thin package for power control devices used in hand-held applications such as mobile phones, PDAs and notebooks. The new STmite package has a maximum thickness of 1.15mm and its footprint is half that of an SMA package and yet it has the same low thermal resistance. A clip is […]
Enlo Technology Co. Ltd. (Taiwan) introduced the new A128025P301 cooling fan, which features an oil-less, aero-plastic, bearing design, and features a maximum airflow of 40cfm, and has an expected lifespan of 8,000h. The fan measures 80mm x 80mm x 25mm and is rated at 12Vdc, 0.17A. It rotates at up to 3,000rpm and produces a […]
Tsinghua Huatian Technology Development Co. Ltd. (Tsinghua, China) announced its new DP4-812 CPU cooler, which offers a maximum airflow of 38.2CFM and...
Zeon Corp. (Louisville, KY) announced that it has developed a new binder polymer for lithium-ion battery negative electrodes that offers substantial performance...
Tsinghua Huatian Technology Development Co. Ltd. (THTD, China) introduced the new AE-P4H2 CPU cooler, which provides a maximum airflow of 38.2CFM and...
Royal Philips Electronics (Eindhoven, the Netherlands) announced that it now offers an extensive range of small logic packages that enhance the miniaturization...
IXYS Corp. (Santa Clara, CA), a supplier of power semiconductors and ICs for power conversion, motor control, medical electronics and telecommunication applications, announced its new direct-aluminum-bonded (DAB) substrate technology. The DAB technology is claimed to be more advanced than the direct-copper-bonded (DCB) technology, which has been used for the production of integrated power semiconductor modules, […]
Fujipoly America Corp. (Carteret, NJ) announced the SARCON® XR-e and XR-j thermal gap filler pads that feature thermal conductivity and thermal resistance,...
Tsinghua Huatian Technology Dev. Co. Ltd. (China) announced the new AE-2388 CPU cooler, which features a cooling fan that rotates at 3,000rpm...