Furukuwa Develops Thin Sheet-Type Heatsink

Furukawa Electric Co. Ltd. (Japan) announced the development of a sheet-type heatsink that the company claims is the world's smallest and enables the cooling of ICs in mobile electronic devices. The heatsink has a thickness <1mm and can also be used to equalize the heat distribution within the casings. The company also claims the device's heat conductivity, although dependent to the shape, is better compared to a 10mm thick copper block. A sheet-type heatsink measuring 150mm x 20mm x 0.6mm can dissipate up to 10W of heat.