Packaging and Cooling

Philips Announces New DQFN IC Package

Royal Philips Electronics (Eindhoven, the Netherlands) introduced its new depopulated, very-thin, quad flat-pack, no-leads (DQFN) logic integrated circuit (IC) package, which enhances miniaturization of the circuit board and frees board space for additional components and functions. Designed with a footprint of 2.5mm x 3mm in a 14-pin configuration, the DQFN package is 75 percent smaller than existing TSSOP packages.

In addition to significant size reduction, the DQFN package also offers improvements in heat dissipation and ease of board assembly. The package incorporates an exposed die paddle, providing a 20 percent improvement in heat dissipation over a comparable TSSOP package. The package does not require leads, eliminating co-planarity and bent-lead issues.

Royal Philips Electronics
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