General Semiconductor Intros Surface-Mount Package
General Semiconductor Inc. (Melville, NY) introduced a ultra-small leadless package that has been designed to meet the space and performance requirements for tomorrow's new electronic products. The initial version is a six-pin leadless package that meets the power-handling capability of an industry-standard SOT-23 with the footprint (1.6mm x 1.6mm) of a SC-75, which takes up 65 percent less area than the SOT-23. In addition, the package has an extremely low 0.7mm profile, making it suitable for use in portable electronics, such as cell phones, hand-held computers and other digital consumer applications.
The initial product offering will be a GENFET MOSFET, designated GF3441-SS3, and a TVS-diode array, designated the GMF05C-HS3. The GF3441-SS3 is a 20V, 3.3A p-channel GENFET. The GMF05C-HS is rated at 200W for an 8µs/20µs surge and can protect up to five I/O data lines.
Pricing for the GF3441-SS3 is $0.27 and the GMF05C-HS is $0.18 in 10,000-piece quantities. Engineering samples are currently available and full production is expected by the end of 2001.
