Anderson Power Products (APP) now offers two new and improved Powerclaw contacts, the Horizontal and Vertical Mini-Powerclaws. Like their predecessors, the Mini-Powerclaw...
ERNI announced today that it now offers single-pole Power Taps with press-fit termination. Press-fit technology is the preferred means for mounting most...
Tyco Electronics now offers the MINIPAK HD connector designed to carry high-density power and signal as required in the developing MicroTCA standard....
Laird Technologies‘ Thermal Product business unit (formerly known as Thermagon) has added the T-gard™ 5000, a thermally conductive, low-cost, film-based electronic insulator for switching-mode power supply (SMPS) devices used in telecommunication and computer networking products. T-gard 5000 offers SMPS manufacturers a solution that is both superior to fiberglass insulation in dielectric strength and consistency as […]
Enabling lighting system design engineers to run high brightness LEDs at full power without thermal degradation, TT electronics IRC Advanced Film Division’s...
Gallium nitride (GaN)-on-diamond semiconductor wafers are now available from Group4 Labs LLC. The new Xero Wafer™ sits less than 0.5 nanometers away...
Positronic Industries‘ new Dragonfly Series is targeted for use in applications requiring a high reliability miniature connector, which offers signal and/or power...
Emerson Network Power has added four models of the Liebert DS system and a new condenser system for the Liebert DS that...
TT Electronics IRC Advanced Film Division (Corpus Christi, TX) has developed a new substrate technology that can offer significant benefits over conventional polymer-based insulated metal substrates (IMS). Designated Anotherm™, IRC's new material consists of a thermally-conductive aluminum alloy substrate insulated by a thin, chemically grown, anodized dielectric layer, with solderable screen printed conductors applied to […]
GIHA Technology Inc. (China) released its CPF-706 central processing unit (CPU) coolers, which are suited to AMD CPUs. Available with an 80...
Phihong USA (Fremont, CA) has developed a single-port power injector for Power-over-Ethernet (PoE) applications for use with Gigabit systems. The PSA20U is...
Advanced Interconnect Technologies (AIT, Singapore) introduced a new stacked-die, quad-flat, no-lead, multi-chip module (QFN-MCM) package that will offer space-saving and cost-saving advantages...
Global WIN Technology Co. (Taiwan) released its nanometer ceramic bearing cooling fans that feature lifespan double that of sleeve or ball-bearing fans....
Cirmaker Ind. Co. Ltd. (Taiwan) released its HeatSink-01 Series of heatsink modules designed for Intel Pentium 4 and AMD central processing units....
Toshiba America Electronic Components Inc. (TAEC, Japan and Irvine, CA) announced its new L-Flat surface-mount packages for high-power rectifier diodes, which utilize a lead-clamp structure to reduce mounting area by 50% or more compared to currently available industry-standard packaging. In addition, TAEC introduced an extensive line of L-Flat diodes, with average forward current ratings from […]