Wall chargers are among the first consumer application that uses GaN devices. The main advantage of moving from Si to GaN is...
Showa Denko (SDK) has developed a second generation of high-grade SiC epitaxial wafers (HGE-2G) for power semiconductors. SDK has been mass-producing the...
Transphorm Inc. announced that the U.S. Department of Defense (DoD) Office of Naval Research (ONR) has exercised a three-year $15.9 million option...
Microsemi Corporation offers the MSCSICPFC/REF5, a scalable 30kW, three-phase Vienna power factor correction (PFC) topology reference design featuring its silicon carbide (SiC)...
Researchers at King Abdullah University of Science and Technology (KAUST) have successfully combined sensing, energy-harvesting, current-rectifying, and energy-storage functions into a single...
Wolfspeed‘s CAB450M12XM3 1200V 450A all silicon carbide half-bridge module maximizes power density while minimizing loop inductance and enabling simple power bussing. The...
The IGT60R190D1S CoolGaN™ 600V e-mode power transistor from Infineon delivers fast turn-on and turn-off speed, minimum switching losses and enables simple half bridge...
The QPA2308 MMIC power amplifier from Qorvo provides high-power density and power-added efficiency for 5GHz to 6GHz RF-based designs. Fabricated on Qorvo’s...
Power Integrations today announced new members of its InnoSwitch™3 families of offline CV/CC flyback switcher ICs. The new ICs feature up to...
GT Advanced Technologies (GTAT) has announced its CrystX™ silicon carbide (SiC) material for use in power electronics applications such as electric vehicles....
The NCP51820 high−speed, gate driver from ON Semiconductor is designed to meet the stringent requirements of driving enhancement mode (e−mode), high electron...
UnitedSiC has added two new TO220-3L package options to its growing range of hard-switching UF3C FAST series of 650V SiC FETs. The...
SUNY Polytechnic Institute reported that Interim Vice President of Research Advancement and Graduate Studies, Dr. Shadi Shahedipour-Sandvik and Associate Professor of Nanoengineering,...
University of Illinois electrical engineers have cleared another hurdle in high-power semiconductor fabrication by adding the field's hottest material - beta-gallium oxide...
Infineon has introduced a 1200V version of it the EasyPACK™ 2B hybrid SiC and IGBT power module. The company says that compared...