Components

1200V Hybrid SiC and IGBT Power Module

Infineon has introduced a 1200V version of it the EasyPACK™ 2B hybrid SiC and IGBT power module. The company says that compared with traditional 3-level neutral-point-clamped topologies, the EasyPACK™ 2B’s advanced neutral-point-clamped (ANPC) inverter design supports an even loss distribution among semiconductor devices.

Infineon says that the module is optimized for sweet spot losses of the CoolSiC™ MOSFET and the TRENCHSTOP™ IGBT4 chipsets respectively, and it features increased power density and offers switching frequency of up to 48kHz.

The power module is especially well suited for the needs of a new generation 1500V photovoltaic and energy storage applications. The new ANPC topology supports a system efficiency of more than 99%.

Using the hybrid Easy 2B power module in applications such as the dc-ac stage of a 1500V solar string inverter allows coils to be smaller than with devices with a lower switching frequency. It, therefore, weighs considerably less than similar inverters with purely silicon components.

Additionally, the losses with silicon carbide are smaller than with silicon. For this reason, less heat has to be dissipated. So the heat sink can also shrink. Overall, this translates to smaller inverter housings and system-level costs savings. The 3-Level inverter design reduces complexity compared to 5-level topologies.

Block diagram (Click on image to enlarge)

The Easy 2B standard package for power modules is characterized by what the company describes as industry-leading low stray inductance.

Additionally, the integrated body diode of the CoolSiC MOSFET chip ensures a low-loss freewheeling function without the need for an additional SiC diode chip.

The NTC temperature sensor aids the monitoring of the device, and the PressFIT technology reduces assembly time for mounting the device.

Summary of Features
  • Full 1500Vdc capability (with 1200V switches)
  • High current density
  • Best in class switching and conduction losses
  • Low inductive design
  • RoHS-compliant modules
Benefits
  • Highest efficiency for reduced cooling effort
  • Higher frequency operation
  • Increased power density
  • Optimized customer’s development cycle time and cost
Availability

The hybrid EasyPACK 2B (F3L11MR12W2M1_B65) is available now.

Infineon Technologies AG
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