Alpha and Omega Semiconductor Limited (AOS) introduced its new Ground Exposed Die Pad Power IC platform, an innovative packaging technology capable of...
NuSil Technology LLC, a global specialist in silicone materials for the electronics and photonics industries, announced its EPM1-2493, a low-viscosity, low modulus silicone elastomer with a nominal thermal conductivity of 1 W/mk. Offering bond lines as thin as 5 microns, EPM1-2493 can be used to adhere materials with differing coefficients of thermal expansion (CTE) for […]
ROHM Semiconductor announced the development of the RBxx8 series of ultra-low IR Schottky barrier diodes capable of operating at high temperatures, enabling...
Linear Technology Corp. introduced the LTC2996 high accuracy temperature sensor for 2.25 to 5.5V systems. The LTC2996 measures a remote diode’s temperature with ±1°C accuracy and its own die temperature with ±2°C accuracy while rejecting errors due to noise and series resistance. The device provides a voltage-proportional-to-absolute-temperature (VPTAT) output, as well as individual undertemperature and […]
Vicor Corp. introduced its new Picor PI33XX Cool-Power® ZVS buck regulator series that affords board-level designers maximum power density and flexibility for...
Nextreme Thermal Solutions announced the availability of new thin-film thermoelectric cooling products that offer 55°C of cooling performance at an ambient temperature...
Kruunutekniikka Oy, a supplier of technical plastic products, has introduced Coolics™ a new patent pending innovation using a proprietary technology that allows the circuit board to be inserted inside the injection moulded LED casing. The thermally conductive plastics used at Coolics transfers heat directly through LED casing, making it easier to control the direction of […]
Advanced Thermal Solutions, Inc., (ATS) has developed a heat sink design calculator, as an iPhone app, that identifies the proper heat sinks to solve most component-level cooling issues. The app allows engineers to input the essential specs and then research online for heat sinks that fit their requirements. The new Heat Sink Design Tool app […]
Laird Technologies, Inc. announced that it has expanded its Thermal Management Solutions portfolio with the addition of its Liquid Cooling Systems (LCS) product line. Laird Technologies’ liquid cooling solutions are robust, self-contained units that remove large amounts of heat from densely packed electronic environments by recirculating a coolant to a predefined temperature set point. Removing […]
Micropelt announced its new Thermogenerator Package (TGP), which makes thermal energy harvesting ready for mass production. The new device allows for automatic assembly of autonomous dc power supplies for ultra low power wireless sensors and actuators. Battery maintenance, so far preventing wireless monitoring sensor networks from really taking off, can be eliminated by TGP-enabled autonomous […]
Micropelt GmbH, maker of thermogenerator chips (TEG), announced its TE-CORE, a maintenance-free self-sustaining power source for ultra low power wireless applications. The...
Behr America is creating a new thermal management portfolio to meet progressively stricter automotive emissions and fuel-economy legislation worldwide. Behr America states that it technologies are leading the industry in areas which are the focus of the automotive industry’s research and development activities – vehicle electrification, internal engine combustion efficiency and environmental sustainability improvements. Electrification […]
Orion Fans, a division of Knight Electronics, has developed a new line of smart-switched rack power distribution units (PDUs). Often used in computer data centers and other electrically intensive applications, Orion Fans’ Smart Switched PDU features outlets that can be sequentially started, controlled and monitored remotely. The PDU monitors the devices plugged into it and […]
Seiko Instruments Inc. (SII) announced on the S-5844 series, which the company says is the world’s lowest power consumption 180nA temperature switch IC. The series features 1.65V low operating voltage in an ultra-small 1.0 x 1.0mm package operating over a wide temperature range from -40 to +125°C. The new temperature switch ICs have been optimized […]
Utilizing the science of real honey bees, JaroThermal’s newest "Honeycomb heat sink" directs heat towards the outside, while producing a steady flow of cool air on the inside. Thanks to a multi-holed design and increased surface area, the Honeycomb optimizes cross ventilation, while simultaneously cooling the surrounding ambient air. Applications include a wide range of […]