Orion Fans has developed a new series of small, powerful vane axial (VXC) fans for harsh, high-static pressure environments for medical, networking...
Infineon Technologies AG today introduced a TO 247-4 pin package. The added fourth pin acts as a Kelvin source to effectively reduce...
Advanced Thermal Solutions, Inc. (ATS) has added to its line of maxiGRIP™ attachment systems for fast, secure mounting of heat sinks to...
AVX Corporation has developed a coplanar, connector-less contact system that optimizes lateral PCB alignment and maximizes mating tolerances in rugged power interconnect...
Orion Fans has designed a series of AC and DC fans tested to tough environmental conditions, including salt fog, salt spray, temperature...
FCI has developed a hermaphroditic board-to-board connector that can be rotated to any angle between +90° and -60°. The RotaConnect rotatable board-to-board...
FCI has developed a series of power distribution systems that provide exceptional performance with repeatable accuracy. Utilizing laminated bus bars and plates, FCI's power distribution systems are engineered for easy connectivity and designed to save space, lower costs and provide pluggable modularity to allow equipment expansion and changeovers. FCI's power distribution systems optimize available cabinet […]
Docea Power, Inc. announced new releases of Aceplorer 3.1 and AceThermalModeler 2.0. Aceplorer 3.1 features a new solver for coupled power and thermal transient simulations featuring 1000x performance gains over the previous versions and a communication protocol enabling the co-simulation of Aceplorer models with virtual platforms and performance analysis tools. AceThermalModeler 2.0 (ATM) improves its […]
Advanced Thermal Solutions, Inc. (ATS) has launched a new product line of maxiFLOW heat sinks, specifically designed for cooling standard eighth-, quarter-,...
By embedding a leading-edge 50x50x13 mm fan inside of a skived-copper-fin heatsink, Jaro Thermal Inc.‘s unique “Skive” Cooler significantly reduces height requirements...
CoorsTek, Inc. announced the introduction of aluminum nitride substrates. Targeted for use in the rapidly growing LED market and other markets where high heat dissipation is useful, these ceramic substrates boast a thermal conductivity of 170 W/m K. CoorsTek AlN (aluminum nitride) ceramic substrates feature a very high dielectric strength, are a non-toxic alternative to […]
Amphenol Aerospace has enhanced its 2M Series connectors for interconnect applications that require high performance. These upgraded micro-miniature connectors are 71% lighter,...
Diagonal fans are ideal for applications with strict requirements regarding air performance with high back-pressure and small installation space. The new fans of the DV6300 series from ebm-papst now go a step further. Besides improved blower output, the fans with electronically regulated S-Force motor also offer additional functions such as temperature based speeds, active motor […]
Laird Technologies, Inc. announced the release of its new AA-250 Outdoor Cooler Series. The AA-250 Outdoor Cooler Series are ruggedized Air-to-Air thermoelectric...
Laird Technologies, Inc. announced the release of two new Tflex™ series thermal gap fillers. The Tflex SF800 and Tflex SF200 are the...