Advanced Power Technology Inc. (APT, Bend, OR) announced its new product line of discrete 300 V IGBTS, which use APT's latest-generation Power MOS 7® technology, and are offered in TO-220, TO-247, D2 and D3 packages. They are designed as cost-effective replacements for 200 V to 300 V MOSFETS in switching applications up to 200 kHz, […]
Powerex Inc. (Youngwood, PA) announced its new NF Series IGBTs, in a newly developed six- or seven-in-one packaging, which utilize a fifth-generation...
Ansoft Corp. (Pittsburgh, PA) announced its new HFSS™ v9.2, which is used for a broad class of high-speed and high-frequency applications, including integrated circuit devices and microwave/radio frequency components. The new release doubles the size of addressable 3D designs through access to additional memory on Microsoft Windows®-based personal computers; enhances the ability to automatically generate […]
The Applied Power Electronics Conference and Exposition (APEC), a leading worldwide conference and exhibit for practicing power electronics professionals, announced a call for papers for the APEC 2005 event to be held at the Austin Hilton in Austin, TX, March 6-10, 2005. The APEC conference, jointly sponsored by the Institute of Electrical and Electronic Engineers […]
Chiaphua Components Ltd. (Hong Kong) introduced its BM2EFB Series of brushless dc motors, suitable for fans and ventilators, which featuring a rated...
Fairchild Semiconductor International (South Portland, ME) introduced a new 1,000 V/60 A IGBT that delivers switching and conduction as well as avalanche...
TriQuint Semiconductor Inc. (Hillsboro, OR) and Ansoft Corp. announced its new process design kit (PDK) supporting TriQuint's 0.6-micron, MESFET, three-metal-interconnect, gallium arsenide, IC process, TQTRx, for use with Ansoft Designer™ Volume 2. The new PDK provides monolithic microwave integrated circuit designers with an electronic design automation flow that maximizes performance and yield while reducing design […]
Tyco Electronics Power Systems Inc. (Dallas, TX) announced new single-in-line package (SIP) versions of its 16 A SuperLynx™ II, 10 A Austin...
Renesas Technology Corp. (San Jose, CA) announced its system-in-package (SiP) device, "Driver-MOSFET Integrated SiP" that integrates a driver IC and two power...
Texaco Ovonic Hydrogen Systems LLC (TOHS, Rochester Hills, MI) announced that the US Department of Transportation (DOT) has approved the transport of hydrogen in metal-hydride storage systems developed by TOHS for portable applications. The approval represents an early step to the advancement of the hydrogen economy as it now enables customers across the US to […]
National Semiconductor Corp. (Santa Clara, CA) announced that it will be doing a major overhaul of its package technology, removing at least 95 percent of the lead used in its processors in an effort to be more environmentally conscious. The company will offer lead-free packages for its complete line of IC products by the end […]
Danaher Corp. (Washington, DC) introduced its new Kollmorgen CARTRIDGE direct drive rotary (DDR) servomotors, which combines the performance advantages of frameless direct...
Stirling Technology Co. (STC, Kennewick, WA), a developer and manufacturer of cycle power generation, compression, and cooling products and technologies, announced that it is moving into limited production to fulfill commitments on several major government contracts. "Stirling Technology is transitioning from a research and development mode into a production mode," stated President and CEO J.D. […]
GrafTech International Ltd. (GTI, Wilmington, DE) introduced its new SpreaderShield™ thermal management solution, which joins its eGraf® product line. SpreaderShield is a natural graphite solution that distributes heat evenly in two dimensions, eliminating "hot spots," shielding components from heat sources and improving performance in consumer electronics. The eGraf SpreaderShield thermal management products are custom designed […]
ST Assembly Test Services Ltd. (STATS, Singapore) has rolled out a new dual-row version of its quad leadless package that delivers higher I/O performance. The company said that its Dual Row Quad Leadless Package (QLP-DR) features an expanded number of I/O terminal pads in a smaller footprint. The lead frame design of the QLP-DR features […]