Tessera Technologies Inc. (San Jose, CA), a developer of semiconductor packaging technology for miniaturization of electronic products, announced that has priced its follow-on offering of 4.1 million secondary shares at $18.43 per share. The company reported that all of the shares were offered by selling stockholders and the company will not receive any proceeds from […]
California Micro Devices Corp. (Milpitas, CA) announced its CM3018 family of 150 mA CMOS regulators in a compact chip-scale package, form factor....
Scientists at International Business Machines Corp. (IBM, Armonk, NY) claim to have found a way to make thin films of semiconducting materials that allow electrical charges to move through them about 10 times faster than had been reported for all other similar approaches. The research, conducted at IBM's T.J. Watson Research Center, finds that such […]
Fairchild Semiconductor International (South Portland, ME) introduced its new dual n-channel FDC6000NZ MOSFET device that combines Fairchild's PowerTrench® MOSFET silicon technology with...
Texas Instruments Inc. (TI, Dallas, TX) narrowed its first-quarter guidance to the top part of the previously forecast range. The company said revenues will be between $2.835 billion and $2.950 billion. The previous forecast was between $2.720 billion and $2.950 billion. TI said it expects earnings per share of between $0.19 and $0.22. The previous […]
Advanced Power Technology Inc. (APT, Bend, OR) announced its new product line of silicon carbide (SiC) Zero Recovery™ Schottky diodes in plastic...
Great Wall Semiconductor Corp. (GWS, Tempe, AZ), a designer, developer and manufacturer of high-performance power semiconductors using lateral MOSFET technology, announced a...
Ansoft Corp. (Pittsburgh, PA) released its new ePhysics™ software that expands the capabilities of HFSS™ and Maxwell® 3D. With ePhysics, engineers can...
Cypress Semiconductor Corp. (San Jose, CA) and Silecs Inc. announced that the two companies have agreed to collaborate on the development and testing of Silecs' non-porous, low-k dielectric materials in certain devices manufactured by Cypress. The key objectives are to improve speed performance, lower power consumption, reduce manufacturing costs and improve overall device yield. The […]
ATMI Inc. (Danbury, CT), a supplier of materials and packaging to semiconductor manufacturers, announced financial results for its fourth quarter, and for the year 2003. Revenues from continuing operations were $52.4 million in the fourth quarter, up 24 percent sequentially from the third quarter, and 41 percent greater than the fourth quarter of last year. […]
International Rectifier Corp. (IR, El Segundo, CA) introduced three new integrated power modules (IPMs), expanding the iMOTION™ family, which simplify variable-speed, electronic motor control circuits found in energy-efficient appliances, and feature a three-phase inverter power stage with gate drivers and auxiliary circuitry in an isolated package. The new devices combine low-loss, non-punch-through, short-circuit-rated IGBTs with […]
Fairchild Semiconductor International (South Portland, ME) introduced four 30V, n-channel, PowerTrench® MOSFETs that deliver high efficiency and ruggedness in a small footprint...
Xilinx Inc. (San Jose, CA) issued a product advisory regarding defects in certain lots of its Virtex-II Pro and XC2V6000 products using flip chip packaging. The affected parts were manufactured using improper solder material that may cause random upset of device configuration, the company said in a statement. "This issue is isolated to a limited […]
Darnell Group Inc. (Corona, CA) announced that it has reached a publications milestone with its PowerPulseDaily email newsletter and PowerPulse.Net website publications....
Titan Computer Co. Ltd. (Taiwan) debuted its TTC-D9TB/CU35/R1 CPU cooler designed for AMD Socket-462 or Intel Socket-370 processors. The cooler is made...