Active Power Inc. (Austin, TX), a developer of battery-free, power quality products, announced its newest alternative energy storage technology, the CleanSource™ XR,...
Allixon Corp. (Toronto, Canada) has entered into discussions with a private company in the field of semiconductor packaging technologies, the developer of a novel device packaging technology, which has developed a family of proprietary products, architected and optimized for RF, system-in-package (SIP), 3D memory stacks, memory devices, MEMS and high power components. The company's solutions […]
Modine Manufacturing Co. (Racine, WI) announced that it has completed the acquisition of the Shanghai, China, assets of the Automotive Climate Control Division (ACC) of WiniaMando Inc. The assets in Shanghai consisted of ACC's wholly owned subsidiary. Modine completed the purchase of ACC's South Korean assets on July 31, 2004. With the completion of the […]
Molex Inc. (India), an electronic components company, announced that it has acquired INCEP Technologies (San Diego, CA), a developer of system-level approaches to power delivery, high-density packaging and thermal management. INCEP's technology is used for microprocessors and communications and networking ASICs. Terms of the deal were not disclosed. The companies said that the two have […]
Adept Technology Inc. (San Jose, CA), a manufacturer of automation for the semiconductor and telecommunications industries, announced that its fourth-quarter fiscal 2004 net revenues from continuing operations were $14.5 million, an increase of 45% over the comparable period in 2003. During the quarter ended June 30, 2004, the company reported pre-tax income from continuing operations […]
Tessera Technologies Inc. (San Jose, CA), a developer of semiconductor packaging technology for miniaturization of electronic products, raised its financial guidance for its third quarter by approximately $2 million, and now expects revenues in the range of $22.3 to $22.6 million. Net income is expected to range between $12 and $12.2 million. The company had […]
EPCOS AG (Germany) announced its new power amplifier with integrated duplexer (PaiD) module for the miniaturization of passive electronic components for the...
The Semiconductor Industry Association (SIA) is seeking proposals from interested investigators, including universities, colleges, laboratories and governmental agencies, to conduct an epidemiological study to assess cancer risk among US wafer fabrication workers from the late 1960s to the present. The SIA study will be one of the largest industry-sponsored epidemiological studies ever undertaken, and will […]
With the return of tight component supply has come the problem of counterfeit ICs, with desperate manufacturers, short of product, being exploited by fraudsters. Christos Papakyriacou, managing director of distribution firm Alpha Micro Components (UK) has warned the industry that some counterfeit components are so credible they are not exposed until actually assembled on a […]
Linear Technology Corp. (LTC, Milpitas, CA) introduced its new LTC4221, a dual Hot Swap™ controller featuring a dual-level circuit breaker and the...
Sipex Corp. (Milpitas, CA), a provider of high-performance, analog integrated circuits, announced its new SP7655, which expands the new PowerBlox™ family of high-current, high-voltage, ultra-miniature, dc-dc buck regulators. The part is packaged in a custom DFN package with three integrated heatsinks for thermal management. The packaging technology produces a small 8 A component, measuring 7 […]
Dallas Semiconductor Corp. (Dallas, TX) introduced its new DS620 digital temperature-sensor IC, which is suitable for low-power and battery-operated systems, and operates...
Vishay Intertechnology Inc. (Malvern, PA) announced that it has published a new and comprehensive data book of Vishay Electro-Films thin-film products. The...
Toshiba America Electronic Components Inc. (TAEC, Japan and Irvine, CA) announced the availability of its new ultra-thin Smart Thin Package (STP) surface-mount...
Tessera Technologies Inc. (San Jose, CA), a developer of semiconductor packaging technology for miniaturization of electronic products, announced that it has signed an agreement that expands the license terms of the existing agreement with Sharp Corp., a leading consumer electronics company. Sharp utilizes Tessera's technology to package many types of semiconductor devices, and incorporates the […]