GIHA Technology Inc. (China) released its CPF-706 central processing unit (CPU) coolers, which are suited to AMD CPUs. Available with an 80...
An interdisciplinary team of scientists at the Technical University of Denmark (DTU) have developed a hydrogen tablet that stores hydrogen in an inexpensive and safe material, enabling storage and transport of hydrogen in solid form. Hydrogen is a non-polluting fuel, but since it is a light gas, it occupies too much volume and it is […]
V-Infinity LLC (Beaverton, OR) introduced its new VPF/VPM-S800-XXR Series of 800 W switching power supplies, which are available in u-frame or fan-cooled,...
IXYS Corp. (Santa Clara, CA) reported that two important patents for its power management integrated circuit (IC) program were issued. US Patent #6,917,227, issued July 12, 2005, covers power MOS driver IC technology that enables higher-efficiency, single and half-bridge gate driver configurations without the cross conduction losses found in other drivers in the market. US […]
Lambda Electronics Inc. (San Diego, CA) launched its new SCS120PW Series of single-output power supplies that can provide 120 W of convection-cooled...
Fairchild Semiconductor International Inc. (South Portland, ME) reported that its Motion-Smart Power Module (SPM) has been selected by Daikin Industries Ltd. for use in its inverter-based air conditioners. Daikin selected Fairchild’s FSBS15CH60 due to the product’s performance and packaging, and Fairchild’s history of engineering support. By combining multiple functions into a single Mini-DIP package, the […]
RF Monolithics Inc. (RFM, Dallas, TX), a developer of radio frequency (RF) wireless solutions, announced that all of its products will be compliant with the European Union’s (EU) Restriction of the Use of Certain Hazardous Substances (RoHS) in Electrical and Electronic Equipment directive by the July 6, 2006, deadline. The RoHS directive provides that electrical […]
Stackpole Electronics Inc. (SEI, Raleigh, NC) introduced a new surface-mount power resistor, the HPC Series, which is capable of handling up to...
Sanyo Denki (Tokyo, Japan), a developer of cooling, power, servo and control systems to the computer, telecommunications, semiconductor, and motion control industries,...
AMI Semiconductor Inc. (AMIS, Pocatello, ID), a manufacturer of application-specific integrated circuits and structured digital products, announced plans to consolidate its European wafer fabrication operations. The company said it will close its 4-in wafer fabrication facility in Oudenaarde, Belgium, and will fold operations from that site into its existing 6-in wafer fab, also located in […]
Practical Solar Inc. (Boston, MA) has developed a new, proprietary concentrating solar power (CSP) system to harness energy from the sun. The...
Advanced Interconnect Technologies (AIT, Singapore) introduced a new stacked-die, quad-flat, no-lead, multi-chip module (QFN-MCM) package that will offer space-saving and cost-saving advantages...
DuPont Electronic Technologies (Wilmington, DE) reported that it would license buried capacitance technology from Sanmina-SCI Corp. (San Jose, CA), an electronics manufacturing services provider, in order to meet OEM demand for PCB planar capacitance materials at 25 microns and below. Also, DuPont Interra HK polyimide laminates will now be available to Sanmina-SCI’s existing family of […]
Micrel Inc. (San Jose, CA), a developer of IC and Ethernet solutions, launched the new MIC2296, an efficient dc-dc boost converter that provides up to 34 V, allows for more than 1.2 A of switch current, and delivers a high-power density in a small packaging option. The MIC2296 is suitable for driving OLEDs, TFT-LCD displays, […]
BI Technologies (Fullerton, CA), a subsidiary of TT electronics plc (Patterson, NJ), has developed an engineering sample kit of its SOT-23 packaged...