Artesyn Technologies Inc. (Boca Raton, FL), a developer of power conversion solutions for communications, announced a new Restriction of Hazardous Substances (RoHS) initiative, which will allow the company to substantially reduce the lead, mercury, hexavalent chromium, cadmium, brominated flame retardants and other hazardous substances used in the manufacture of its telecom products. The RoHS initiative […]
Tyco Electronics Power Systems Inc. (Dallas, TX) introduced its new fastPACK 0 family of fast-switching, H-bridge modules in the flow 0 package. The fastPACK 0 family addresses the needs of higher-power, fast-switching applications like welding equipment and switch-mode power supplies, working at frequencies up to 250 kHz. The fastPACK 0 family provides 600 V/60 A […]
Tyco Electronics Power Systems Inc. (Dallas, TX) extended its family of high-power modules in the flow 0 package. With the expansion, the...
The Applied Power Electronics Conference and Exposition (APEC), a leading worldwide conference and exhibit for practicing power electronics professionals, announced a call for papers for the APEC 2006 event to be held February 19-23, 2006, in New Orleans. The APEC conference is jointly sponsored by the Institute of Electrical and Electronic Engineers (IEEE) Power Electronics […]
Picor Corp. (Andover, MA), a power IC subsidiary of Vicor Corp. (Andover, MA), introduced the QPI-8 System-in-a-Package (SiP) device designed to integrate...
Patriot Scientific (San Diego, CA) and The TPL Group (Cupertino CA) announced that they have agreed to end the litigation against each other by unifying their interests in 10 key microprocessor patents originally filed in 1989 and granted in 1998. Under the terms of the agreement, TPL is granted full responsibility and authority for the […]
Toshiba America Electronic Components Inc. (TAEC, Japan and Irvine, CA) announced its new L-Flat surface-mount packages for high-power rectifier diodes, which utilize a lead-clamp structure to reduce mounting area by 50% or more compared to currently available industry-standard packaging. In addition, TAEC introduced an extensive line of L-Flat diodes, with average forward current ratings from […]
Modine Manufacturing Co. (Racine, WI), a a manufacturer of thermal management systems and components for vehicles, fuel cells and electronics, has been awarded a long-term contract by DaimlerChrysler AG (Stuttgart, Germany) to supply engine-cooling modules for heavy-duty Freightliner trucks, and to become a development partner for Mercedes-Benz trucks in Europe. The total contract value to […]
Renesas Technology Corp. (San Jose, CA), a joint venture between Hitachi Ltd. and Mitsubishi Electric Corp., announced a new stacked chip technology that uses a through-hole interconnection method to enable chips to bond at room temperature. The new technology eliminates the need for wire bonding and reduces package thickness by more than 60% for the […]
National Semiconductor Corp. (Santa Clara, CA) announced that all of its products will be in lead-free packages by the middle of next year. Currently, the chipmaker's 15,000 analog and mixed-signal ICs are available in lead-free packages, and by the end of June 2006, National's entire product offering will be sold lead-free, unless deemed exempt. The […]
Tower Semiconductor Ltd. (Migdal Haemek, Israel) reported that both revenue and losses grew in the first quarter, both sequentially and year-over-year. Tower posted first-quarter revenue of $23.2 million and a loss of $55.3 million, or $0.84 per share. In the prior quarter it posted revenue of $30.1 million and a loss of $23.3 million, or […]
AVX Corp. (Myrtle Beach, SC), a manufacturer of passive components, has developed a new range of capacitors designed for high-temperature applications such...
Axcelis Technologies Inc. (Beverly, MA), a semiconductor manufacturing equipment supplier, announced that its board has elected President and CEO Mary Puma to Chairman of the Board, succeeding Stephen Hardis, who has been named Lead Director. Puma's new title is Chairman and CEO. "I am honored to accept the role of chairman of Axcelis' board of […]
Applied Materials Inc. (Santa Clara, CA), a supplier of semiconductor equipment and services, reported that its May quarter net sales rose sequentially 5%, but orders fell both sequentially and year-over-year. The company guided orders for the current August quarter to be down 5% to 10%, with revenue down 10% to 15%, well below expectations. The […]
Atmel Corp. (San Jose, CA) reported that it plans to sell its chip fab in Nantes, France, as part of its cost-reduction efforts. The 6 in wafer fab has a current production capacity of 2,500 wafers per week. Atmel is currently manufacturing semiconductors in BiCMOS, CMOS and non-volatile technologies in line widths down to 0.5 […]