Emerson Network Power introduced the new Liebert XDF from Liebert Corp. (Columbus, OH), which is a plug-and-play enclosure system that allows for quick deployment of high-density equipment. The Liebert XDF extends the "mini-computer room" concept pioneered by Liebert to the requirements of high-density server and communications equipment. The Liebert XDF uses an air-cooling, water-cooling or […]
Bodine Electric Co. (Chicago, IL) announced itss new Pacesetter&tradel; family of ac inverter duty motors, gearmotors and ac variable-speed controls, which consist of all new motor and gearhead combinations for maximum output power in a small package. Applications for the new inverter duty gearmotors include factory automation, machine tools, conveyors, and materials handling and packaging. […]
UTC Power, a division of United Technologies Corp. (South Windsor, CT), announced the official unveiling of the first US supermarket installation of the PureComfort™ 240M combined cooling, heating and power (CHP) system. In a ribbon- cutting ceremony at the A&P fresh store in Mount Kisco, NY, local and federal government officials celebrated the installation of […]
Jumbotek Advanced Technologies Inc. (Taiwan) released its latest series of NTC thermistors that are suited to temperature compensation applications. The SMDs are available in footprints of 1005 (0402), 1608 (0603), 2012 (0805) or 3216 (1206), and feature high B values. The thermistors have tin-plated terminations.
Darnell Group Inc. (Corona, CA) announced publication of its latest report, "DC-DC Converter Modules: Global Market Forecasts and Competitive Environment, Eighth Edition." The new updated 363-page report provides a detailed and in-depth examination of the dc-dc converter market and the trends that drive this market. Dc-dc converter opportunities and threats are exposed in an analysis […]
Glary Power Technology (Taichung, Taiwan) introduced its new CPH Series ultra-high-power, half-brick module with Sink-Plate technology to enhance its derating performance. With...
Fairchild Semiconductor International Inc. (South Portland, ME) announced that its Global Power Resource™ power design and application lab in Europe is expanding to provide complete system power solutions for motion and motor control. Fairchild will invest in new equipment as well as motion and motor control engineers at its Furstenfeldbruck, Germany site. The center has […]
Orion Fans (Dallas, TX), a division of Knight Electronics Inc., announced that it now offers a comprehensive line of thermal management products, including fans, fan trays and controllers, which offers a suitable one-stop solution for designers and manufacturers seeking to resolve thermal management issues with their equipment. "With the recent release of our new high-performance […]
Siliconix Inc. (Santa Clara, CA), a subsidiary of Vishay Intertechnology Inc. (Malvern, PA), reported net income of $11.9 million, or $0.40 per share, for the first quarter ended April 2, 2005. This is an increase of 19% over the net income of $10.0 million, or $0.33 per share, in the fourth quarter of 2004 and […]
Tower Semiconductor Ltd. (Migdal Haemek, Israel) announced the appointment of Russell Ellwanger as Chief Executive Officer. Ellwanger, who is to take the helm May 1, 2005, brings more than 25 years of industry experience and most recently was a group Vice President at Applied Materials Inc. Ellwanger is familiar with Israel, where Tower is based, […]
ATMI Inc. (Danbury, CT), a supplier of materials and packaging to semiconductor manufacturers, reported that first-quarter revenues of $66.1 million were up 2% sequentially and up 18% year-over-year. Net income for the first quarter was $6.1 million, or $0.19 per diluted share, compared to net income of $0.19 per diluted share of first-quarter 2004, which […]
Advanced Analogic Technologies Inc. (AnalogicTech, Sunnyvale, CA), a developer of power management solutions, announced that it has been certified by Samsung Electronics Co. Ltd. as an Eco-Partner Affiliate Company in its Green Procurement Program. Eco-Partners are suppliers that have fulfilled Samsung's standards for establishing an ongoing environmental quality control system, which is defined as the […]
Picor Corp. (Andover, MA), a power IC subsidiary of Vicor Corp. (Andover, MA), introduced its QPO-2 System-in-a-Package (SiP), an output ripple attenuator...
STMicroelectronics Inc. (ST, Geneva, Switzerland) announced the capability to manufacture ball grid array (BGA) packages 1.6 mm high that contain as many as eight stacked memory chips. The same technology is also being used to pack two memory dies into a 0.8 mm thick ultra-thin fine-pitch BGA (UFBGA). Devices produced using the new technology will […]
Fox Electronics (Fort Myers, FL) expanded its FQ Series of all-quartz crystal packaging technology to include a 5.0 mm x 3.2 mm package size. The FQ5032, which boasts a low profile of 0.8 mm, is suitable for a wide range of portable applications, including hand-held devices such as such as PDAs, MP3s, scanners and GPSs. […]