Intersil Corp. (Irvine, CA) announced the upgraded Endura™ ISL6558 precision, multi-phase, pulse-width modulated controller IC, which features industrial temperature range and near...
Linear Technology Corp. (LTC, Milpitas, CA) introduced the new LTC4008, a 4A, multi-cell, multi-chemistry, battery pack charger with a solution size of...
Qualcomm Inc. (San Diego, CA) announced the availability of the PM6650 power management chip for 3G CDMA terminals. The device is the first member of the company's powerOne family of advanced power management chips and interfaces directly to the company's Mobile Station Modem baseband processors such as the MSM6250 and MSM6500 chipsets. The IC provides […]
Wuxi Xuyang Electronics Co. Ltd. (China) announced its new K Series of bi-directional thyristor diodes (SIDACs), available in DO-15 and DO-201A packages,...
AVX Corp. (Myrtle Beach, SC) announced that it now offers MIL-qualified ceramic capacitors with space-level reliability. The M123 Series capacitors are designed...
International Rectifier Corp. (IR< El Segundo, CA) introduced four new 12V HEXFET power MOSFETs optimized for low-input voltage (typically 3.3V and 5V),...
Hitachi Ltd. (Japan) announced the release of the HD74ALVC163245 and HD74ALVC164245 high-speed voltage translator ICs that support a 16-bit bus width and...
Dialog Semiconductor plc (Germany) announced the development of the DA9010 controller IC for Intel's PXA800F cellular processor to be used for GSM/GPRS...
Intersil Corp. (Irvine, CA) announced its new ISL4260E and ISL83386E LINEARLINK RS-232 interface ICs for use in hand-held, battery-powered and space-constrained devices. The ISL4260E is available in a 5mm x 5mm x 0.9mm QFN package, while the ISL83386E is in a 20-lead TSSOP. Both feature three transmitters and two receivers. The devices operate over a […]
National Semiconductor Corp. (Santa Clara, CA) introduced seven mixed-signal power and lighting management application-specific integrated circuits (ASICs) for the hand-held market. The...
Intersil Corp. (Irvine, CA) unveiled the initial products in a new family of rail-to-rail operational amplifiers (op amps) tailored for the high-performance,...
Shenzhen Bayton Technology Ltd. (Shenzhen, China) announced its new multi-mode transceiver module, which is designed for use in multi-mode, fiber-optic links and...
Microsemi Corp. (Irvine, CA) has introduced the new LX5512E three-stage power amplifier, which is suitable for both IEEE 802.11b and 802.11g NICs and access point standards. Designed using an advanced InGaP/GaAs HBT RFIC fabrication process, the device consumes 115mA of total current, while providing a gain of 30dB.
Maxim Integrated Products Inc. announced its new MAX1565 power supply IC, which integrates high-efficiency, step-up, and step-down dc/dc converters with three step-up controllers into a 5mm x 5mm thin QFN package, enabling it to be used as a power supply solution for digital still and video cameras. The converter's switching frequency is adjustable up to […]
Linear Technology Corp. (LTC, Milpitas, CA) announced its new LT3464, a high-efficiency, micro-power, boost converter with an integrated Schottky diode and output...