PowerPulse.net
Material Developments
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571Power ComponentsII-VI Incorporated Opens New Epi Wafer Facility
II‐VI Incorporated announced the opening of its new high tech compound semiconductor material center of excellence in Champaign, Illinois. The ribbon-cutting ceremony...
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1.3KComponentsCompact UL 1577 Certified Drivers for IGBTs and SiC MOSFETs
Infineon Technologies AG now offers the EiceDRIVER™ 1EDC Compact 300 mil family of single channel gate driver ICs. With an insulation test...
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640Power ComponentsToshiba to Exhibit Multiple New Products at PCIM Europe
Toshiba Electronic Devices & Storage Corporation has announced their participation in PCIM Europe 2018 where they will showcase their comprehensive portfolio of...
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1.4KPackaging and CoolingTDK Acquires Faraday Semi to Bolster Power Solutions with, Si, GaN & 3D Packaging
TDK Corporation announced today the acquisition of Faraday Semi LLC, a U.S.-based venture-backed company engaged in the design of advanced power semiconductor...
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495Power ComponentsPowerBase Pushing for High-Voltage GaN Power Devices
Power semiconductors play an important role in power conversion in a wide range of electronic equipment we use in our everyday lives,...
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773Smart Grid PowerControlling the Crystal Structure of Gallium Oxide for Power Devices
Precise control of the atomic structure of gallium-oxide layers improves the development of high-power electronic devices. A simple method that uses hydrogen...
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734Power ComponentsEPC Announces AEC Q101 Qualification for Two 80V GaN FETs
Efficient Power Conversion Corp. (EPC) announced successful AEC Q101 qualification of two eGaN® devices, opening a range of applications in automotive and...
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5.0KComponentsGaN-based 300V-in, 5A-out Half-Bridge Development Board with Digital Isolation
The EPC9084 development board from Efficient Power Conversion is a 350V maximum device voltage, 5A maximum output current, half-bridge with onboard gate...
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532Switch-Mode PowerGaN Power IC Expert to Chair Major Power Sources Association
Navitas Semiconductor announced that the company's Vice President of Sales & Marketing, Stephen Oliver, has become the chairman of the leading power...
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680Power ComponentsHexaTech Launches 2″ Diameter Aluminum-Nitride Substrate Product Line
HexaTech Inc. announced today the launch of its 2″ diameter aluminum-nitride (AlN) substrate product line. HexaTech is launching this milestone product in...
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2.7KComponents350V GaN Power Transistor is 20-Times Smaller Than Comparable Silicon
Efficient Power Conversion has announced the EPC2050, a 350V GaN transistor with a maximum RDS(on) of 65mΩ and a 26A pulsed output...
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1.4KPower ComponentsWolfspeed is Primary Growth Driver & Projected to be Largest Division at Cree
Cree, Inc. announced revenue for the third quarter of fiscal 2018 was $356 million, which represents a 4% increase compared to revenue...
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538Power ComponentsDiamond-Based Circuits Can Take the Heat for Advanced Applications
When power generators like windmills and solar panels transfer electricity to homes, businesses and the power grid, they lose almost 10 percent...
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5.7KPower QualitySiC Enables 98.5% Efficient 6.6-kW Totem-Pole PFC Reference Design
The TIDA-01604 reference design from Texas Instruments functions from a base of silicon carbide (SiC) MOSFETs that are driven by a C2000...
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2.2KPower Components4D PowerCoil – New Dimension of Wound Inductor Performance Optimization
BLOCK has announced the introduction of its PowerCoil edgewise winding technology which provides unprecedented variability in the design of inductive wound products....
