Vincotech today announced the launch of a new, deeply-integrated intelligent power module (IPM) for 600V applications. The flowIPM 1B CIP 600V features...
Mitsubishi Electric Corporation announced today the launch of a new transfer-molded power semiconductor model in its lineup of Super-mini Dual-In-line Package Intelligent...
Tektronix today announced that the IsoVu Measurement System previewed earlier this year at the APEC 2016 show is now shipping and available...
Raytheon Company has given the U.S. Army a look into the future of missile defense technology, as the company provided its comprehensive...
Efficient Power Conversion (EPC) announces its Phase Eight Reliability Report showing the results of the rigorous set of JEDEC-based qualification stress tests...
Engineers from the University of Utah and the University of Minnesota have discovered that interfacing two particular oxide-based materials makes them highly...
Murata has announced the MGJ1 1-Watt dc-dc converter series manufactured by Murata Power Solutions. These compact devices are designed for driving high-...
Taiyo Yuden Co., Ltd. and GE Ventures announced that GE Ventures has licensed intellectual property (IP) to Taiyo Yuden for fabricating substrates...
To support its accelerating growth throughout Europe, Efficient Power Conversion Corporation (EPC) announced the appointment of Ismosys as its sales, marketing, and technical support representative. Ismosys, founded in 1994, provides support to design houses, designers and engineers across Europe. This is achieved through 10 regional offices covering the entire EMEA and a significant centralized resource, […]
Kettering University researchers in the Advanced Power Electronics Lab (APEL) are part of a team tasked by PowerAmerica with developing a high...
IXYS Corporation announced the availability of the IXFN50N120SK and the IXFN70N120SK both 1200V SiC MOSFETs in SOT-227 packages. Typical applications, among others,...
A project team led by Professor Katsuaki Suganuma, Osaka University, in which Showa Denko (SDK) participates, has successfully developed a hybrid board structure for silicon-carbide (SiC) based power devices which can stably operate even under high-temperature condition of 300 degrees C. This project was organized as university-industry research collaboration under the leadership of Professor Suganuma […]
Efficient Power Conversion Corporation (EPC) has joined forces with ASD Technology Limited (ASD), a Hong-Kong-based company delivering best-in-class customer solutions for applications using the latest eGaN technology. Wireless charging designs using eGaN FETs and IC will be a particular focus on the new efforts. "Delivering innovative solutions, while reducing time to market has been a […]
Raytheon UK’s Integrated Power Solutions (IPS) business unit in Glenrothes, Scotland, has developed a high-temperature, small-form-factor bridge leg power module. Aimed at...
Infineon Technologies AG and Cree, Inc. announced today that Infineon has entered into a definitive agreement to acquire the Wolfspeed Power and...