INCEP Technologies (San Diego, CA) announces the addition of Dr. Carl Hoge as senior IC packaging architect. Dr. Hoge brings over 21...
Maxim Integrated Products (Sunnyvale, CA) introduced the MAX8880/MAX8881 ultra-low-supply-current low-dropout linear regulators. Designed for portable applications, these devices have PMOS pass elements...
IXYS Corp. (Santa Clara, CA) has been granted a patent for its chip-on-chip technology that enables integration for smart power semiconductors. The new patent, US patent No. 6,107,674, covers a power semiconductor device structure in which the power semiconductor chip is used as the substrate onto which other control and driver chips are bonded to […]
According to Forbes.Com (New York, NY) in an article online, International Rectifier (IR, El Segundo, CA) has, in the last four weeks, raised its year 2001 consensus earnings estimate 7 percent, to $2.82 per share. IR, which is a $753 million company, is currently reported to have a cash pile of about $800 million, thanks […]
Murata Electronics North America Inc. (Smyrna, GA) has launched a new line of 0201-packaged negative-temperature-coefficient (NTC) thermistors that the company maintains are among the smallest chip thermistors available. Aside from benefits such as a short lead time and miniature size, Kozo Kagawa, Murata's group product manager, claims that the NTC thermistor has several other engineering […]
RFE International Inc. (Lake Forest, CA) has expanded its surface-mount aluminum electrolytic capacitor product line, the RV3 Series, to include a dual-height...
Micrel Semiconductor (San Jose, CA) has expanded their MIC2010 Series to include Universal Serial Bus (USB) power switch ICs. The new devices...
Siliconix Inc. (Santa Clara, CA) has unveiled a chip-scale power MOSFET packaging technology that they claim will greatly reduce the size of the devices required to manage and convert power in cellular phones and handheld internet appliances. The new Vishay Siliconix Micro Foot devices use a solder bump process along with proprietary techniques developed at […]
Siliconix Inc. (Munich, Germany) unveiled a roadmap for a new power MOSFET packaging technology, which they believe will provide space savings and...
Vishay Siliconix Inc. (Santa Clara, CA) announced that it is sampling power MOSFETs built on a silicon technology that will, they claim, enable a new generation of record-breaking devices for power management and conversion in end products ranging from cellular phones to the fixed communication infrastructure that powers the Internet. The new proprietary TrenchFET process […]
Power Integrations Inc. (Sunnyvale, CA) has announced the availability of a high-power monolithic off-line power supply switcher IC family, which they call...
Texas Instruments (TI, Dallas, TX) has introduced the TLS2254 5V servo/spindle driver ICs. TI claims that these new mixed-signal devices combine best-in-class control solutions to drive a voice coil servo for head positioning and a three-phase brushless dc spindle motor for spinning the recording media with a range of advanced utilities on a single substrate. […]
Microsemi Corp. (Santa Ana, CA) announced that its power management division has developed a new dual-circuit low dropout regulator (LDO) for its lineup of power management integrated circuits. Designated the LX8815 Series, the device, which combines two 1A regulator circuits in a single package, is used to regulate power on circuit boards of applications that […]
International Rectifier (IR, El Segundo, CA) has introduced a new family of hermetically sealed, high-reliability HEXFET power MOSFETs. These hermetically sealed power...
General Semiconductor Inc. (Melville, NY), announced it has received a significant order for its GF6968ED Smart GENFET device in the battery-pack application for wireless handsets. The GF6968ED Smart GENFET is a 20V MOSFET with integrated electrostatic discharge protection. The device is fabricated using General Semiconductor's high-cell-density trench technology. In this particular application, the GF6968ED Smart […]