Motion Control

December 20, 2013

Factory-Programmable Digital Hall-effect Sensors Deliver Custom Solutions

Melexis Technologies NV introduces two new parts to its programmable digital Hall-effect sensor line. The MLX92231 and MLX92211 feature EEPROM memory, allowing...

390

December 19, 2013

Honeywell Launches High-Sensitivity Latching Digital Hall-Effect Sensors

Honeywell Sensing and Control‘s new SS360PT and SS460P high-sensitivity latching Hall-effect sensor ICs with built-in pull-up resistors are high performance yet economical...

534

Motion Control

December 18, 2013

Reversible DC Motor Driver from Diodes Inc Aims to Beat Space Constraints

Diodes Incorporated has introduced a single-chip IC for driving single-coil reversible DC fans and motors. A highly-integrated device, in a choice of...

December 18, 2013

IXYS Releases High-Speed Hard-Switching 650V XPT IGBTs

IXYS Corporation has announced an expansion of its 650V XPT™ IGBT product portfolio. With current ratings ranging from 16A to 200A, these new devices are designed to achieve an optimal balance between the turn-off energy loss and on-state voltage, especially in hard-switching applications. Able to support switching frequencies up to 60 kHz, they allow designers […]

631

December 17, 2013

Fourth-Gen HV Amplifier IC offered in Single- and Dual-Channel Designs

Apex Microtechnology, Inc. has released next generation performance inside the fourth product iteration of the PA41 350V power amplifier first announced over...

960

December 17, 2013

New Multilayer MOV from KOA Speer Protects Against Load Dump Surge

KOA Speer Electronics has introduced a new 40-joule load dump varistor, the NV73DS, in 2L (6.1×5.1mm) size. A multilayer metal oxide varistor...

943

Monitor DC Current with New DT 3-Wire Current Transducer

The new DT Series 3-wire current transducer from NK Technologies is specifically designed in a compact, space-saving case. The DT 3-Wire uses...

Solderable and Sinterable Top-Side Bonding for High-Power IGBT Wafers

IXYS Corporation has introduced solderable or sinterable top side on 200- and 300-Amps, 650-Volt Trench XPTTM IGBT silicon dies. The top side solderable metallization improves the power cycling capabilities of power modules. Replacing the standard bond wire connections by using the standard soldering process improves the power cycling capability, and increases the surge current capabilities […]

859

Stackpole Claims Lowest Heat Rise In A 2512 Size Chip Resistor

The RHC2512 from Stackpole Electronics, Inc. is a high-power 2W rated 2512 size chip resistor with much lower heat rise compared to...

996

Protean and FAW-Volkswagen Partner on In-Wheel Motor Propulsion System

Protean Electric Corp. announced its partnership with FAW-Volkswagen Automotive Co., Ltd. to develop an all new electric propulsion system that will include...

1.4K

High-Temperature SiC Junction Transistors in Hermetic Packages

GeneSiC Semiconductor announced the immediate availability through of a family high-temperature (250 degrees C) 600-V SiC Junction Transistors (SJT) in the 3-...

823

December 13, 2013

TI Redefines MCU Performance in High-End Industrial Applications with Dual-Core MCUs

Announcing its latest innovation in industrial real-time control, Texas Instruments, Inc. (TI) has claimed the new performance standard with the new C2000...

550