Imagine printing electronics with an inkjet printer or even painting solar panels onto building walls. Such technology would cut the cost of...
Amtech Systems, Inc. reported that its subsidiary, PR Hoffman, will be moving to a larger manufacturing facility. The subsidiary has also hired...
Researchers at the U.S. Department of Energy’s Lawrence Berkeley National Laboratory (Berkeley Lab) have developed a graphene device that switches from superconducting...
The TIDM-02002 CLLLC resonant dual active bridge (DAB) with bidirectional power flow capability and soft switching characteristics is a reference design from...
Ascatron reported that it has obtained €3.5 million funding for SiC product development. The company secured the funding as a result of...
Wolfspeed has developed the XM3 power module platform to maximize the benefits of SiC, while keeping the module and system design robust,...
A team of physicists discovered a novel kind of nanotube that can generate current in the presence of light. Devices including infrared...
Researchers at King Abdullah University of Science and Technology (KAUST) say that some of the energy wasted as heat could be recaptured...
The STEVAL-DPSTPFC1 reference design from STMicroelectronics is a 3.6kW bridgeless totem pole boost circuit that achieves a digital power factor correction (PFC)...
Power Integrations announced the SCALE-iFlex™ gate-driver system for IGBT, hybrid, and silicon-carbide (SiC) MOSFET power modules with blocking voltages from 1.7kV to...
Transphorm Inc. introduced its second 900V FET, the Gen III TP90H050WS, enhancing the industry’s only 900V GaN product line. These devices now...
Oxford Instruments Plasma Technology (OIPT) launched a plasma atomic layer deposition (ALD) high volume manufacturing (HVM) solution for the GaN power device...
Sanan Integrated Circuit Co., Ltd., a pure-play wafer foundry with its advanced compound semiconductor technology platform, today announced the commercial release of...
The CRD300DA12E-XM3 300kW three-phase inverter reference design from Wolfspeed demonstrates high system-level power density and efficiency obtained by using Wolfspeed’s new XM3...
The Compound Semiconductor Centre is partnering on the project which was awarded £9.8m in funding through the Advanced Propulsion Centre (APC). The ESCAPE...