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924Automotive ElectronicsHighly-Integrated Hall Sensors Reduce System Costs
The new Hall sensors of Infineon Technologies AG enable automotive, industrial and consumer electronics to meet strict environmental standards. Also, they help...
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796ComponentsRobust AC Capacitors Comply with Safety Class S2
TDK Corporation presents two new series of robust EPCOS ac capacitors. Both the cans and the tops of the components are constructed...
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810ComponentsBipolar Stepper and High-Current DC Motor Driver IC
Allegro MicroSystems has announced a new 40V motor driver IC capable of driving one stepper motor and one dc motor. The bipolar...
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881Automotive ElectronicsRelay Driver IC with Integrated ARM Cortex M0 Core
The TLE984x product family from Infineon brings together the ARM® Cortex®-M0 core and the market proven peripherals of its predecessor TLE983x (XC800...
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921Automotive ElectronicsTDK and Toshiba form EV JV to Make Inverters
TDK Corporation and Toshiba Corporation have agreed to establish TDK Automotive Technologies Corporation, a joint-venture that will engage in the development, manufacture...
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660ComponentsOptically-Isolated Sigma-Delta Modulators Improve Efficiency
Broadcom Limited today announced a new optically-isolated sigma-delta modulator device, the Avago ACPL-C799, designed for a wide range of industrial applications including...
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Automotive Electronics
Renesas and TSMC Collaborating on 28nm Automotive MCUs
Renesas Electronics Corporation and TSMC today announced that they are collaborating on 28nm (nanometer) embedded flash (eFlash) process technology for manufacturing microcontrollers (MCUs) targeted at next-generation green and autonomous vehicles. The automotive MCUs employing this new 28nm process technology are slated for sample shipment and mass production in 2017 and 2020, respectively. Renesas and TSMC […]
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798Batteries and Portable PowerCurrent-Compensated Chokes from 0.3A to 10A
The Schaffner Group is expanding its already highly-successful range of current compensated EMC correcting chokes. Horizontal and vertical mounting options are available...
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1.2KAutomotive ElectronicsEpiGaN Expanding into Asia with ACAPITAL Investment
EpiGaN announced that the Brussels/Beijing-based European private equity fund ACAPITAL has joined the initial investors in EpiGaN to fund the company’s expansion...
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950Automotive ElectronicsHigh-Permeability, Nanocrystalline Common-Mode Chokes
Pulse Electronics Power BU adds a new series of high permeability, nanocrystalline products to its lineup of common mode chokes – the...
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1.2KBatteries and Portable Power22V, 13.1mOhm, 4A Integrated Power Switch
Silego has added the SLG59H1009V, a high-performance, self-powered 13.1mΩ NMOS power switch designed for all 4.5- to 22-V power rails up to...
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1.4KAutomotive ElectronicsOn Semi to Sell Ignition IGBTs and More to Littelfuse
The U.S. Federal Trade Commission (FTC) has issued a ruling that requires ON Semiconductor to divest Its ignition IGBT business as a...
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855European Power NewsCable-to-Cable Connector Hood offers Fast Installation
Harting has introduced a new cable-to-cable industrial connector hood which offers secure moisture protection to the IP67 and IP69K, allowing the speedy...
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Automotive Electronics
Hua Hong Semi Taps International MCU Markets
Hua Hong Semiconductor Limited today announced that its shipment of microcontroller (MCU) chips in the first half of 2016 grew to 1.2 billion, a year-on-year increase of 50%, breaking the historical record. With its comprehensive embedded non-volatile memory (eNVM) technology solutions to support 8-32bit MCU products including the automotive-grade eFlash MCU, the Company actively taps […]
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1.2KComponentsIPM with SiC Boost Diode for 150kHz Operation
Vincotech today announced the launch of a new, deeply-integrated intelligent power module (IPM) for 600V applications. The flowIPM 1B CIP 600V features...
