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1.0KComponents60V / 1.29 milliOhm FETs with Double-Sided Cooling
Toshiba Electronics Europe (TEE) has extended its range of high-efficiency U-MOS IX-H MOSFETs with an N-channel device in a ‘DSOP Advance’ SMD...
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1.2KAutomotive ElectronicsWolfspeed Acquisition by Infineon is Now “Uncertain”
Cree, Inc. today provided an update regarding its definitive agreement to sell its Wolfspeed Power and RF division (Wolfspeed) Infineon Technologies AG....
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745European Power NewsVAC Anticipates Electric Drives in Aviation in 2017
Goodbye hydraulic, hello electric: electric drive systems and motors are becoming increasingly widespread in all kinds of areas, from robotics to motor...
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725Automotive ElectronicsHigh-Accuracy and High-Resolution Hall-Effect Sensors
The new A1377 from Allegro MicroSystems Europe is a programmable linear Hall-effect sensor IC designed for applications that require high accuracy and...
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1.0KAutomotive ElectronicsNexperia Emerges with Discretes, Logic and MOSFETs
Nexperia, the former Standard Products division of NXP, today announced the formal completion of its launch as a separate entity. Headquartered in...
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Automotive Electronics
Atmel Acquisition Boosts Results for Microchip
Microchip Technology Inc. reported results for the three months ended December 31, 2016 including GAAP net sales for the third quarter of fiscal 2017 of $834.4 million, up 54.4% from GAAP net sales of $540.3 million in the prior year’s third fiscal quarter. GAAP net income from continuing operations for the third quarter of fiscal […]
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624ComponentsZero-Drift, Zero-Crossover Operational Amplifier
Continuing to set the standard for precision amplifiers, Texas Instruments (TI) today introduced the first operational amplifier (op amp) to offer both...
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1.2KComponentsSquare Body GDTs Protect Against Overvoltage Transients
Littelfuse, Inc. today introduced the smallest (5.0 x 5.0 x 4.2mm) squared Gas Discharge Tube (GDT) with a 5kA surge capability and...
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1.3KAutomotive ElectronicsHitachi Automotive and Honda to form EV Motor JV
Hitachi Automotive Systems, Ltd., and Honda Motor Co., Ltd., today announced the signing of a Memorandum of Understanding, aiming to establish a...
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1.1KAutomotive ElectronicsMotor Control for SiC Drives Embedded in Automotive MCUs
Renesas Electronics today announced the development of a circuit technology dedicated for motor control that realizes green vehicles satisfying stricter automotive CO2...
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Automotive Electronics
Structural Growth Drives Strong Start for Infineon in FY17
Infineon Technologies AG reported results for the first quarter of the 2017 fiscal year (period ended December 31, 2016). Compared with the preceding three-month period Infineon Group revenue fell by 2 percent from €1,675 million to €1,645 million in the first quarter of the 2017 fiscal year. Whereas revenue in the Power Management & Multimarket […]
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European Power News
Aggressive Cost-Cutting Improves Results at IXYS
IXYS Corporation announced financial results for its third fiscal quarter ended December 31, 2016. Net revenues for the quarter ended December 31, 2016 were $79.5 million, an increase of 5.8%, as compared to $75.1 million in net revenues from the December 2015 quarter. Sequentially, net revenues in the December 2016 quarter increased by $855,000 from […]
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871Communications PowerGaN Transistor Thermal RC Models Enhance SPICE Simulations
To support customers who are modeling new systems using SPICE simulations, GaN Systems has released individual computer models for each of their...
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629Automotive Electronics3MHz Chopper Op Amps with Rail-to-Rail Input and Output
The TSZ182 dual precision op amp from STMicroelectronics combines low and extremely temperature-stable input-offset voltage with the added advantages of a 3MHz...
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Automotive Electronics
EU CHALLENGE Project Seeks 3C-SiC Devices for EVs
CHALLENGE is a 48-month European Union HORIZON 2020 project financed under the Nanotechnologies, advanced Materials, Biotechnology and Production (NMBP) work program that studies growth, processing and devices in cubic silicon carbide (3C-SiC). 3C-SiC technology is expected to have a large impact on the future power device market and is particularly suited for implementation in hybrid […]
