Heidenhain Corp. is working with Texas Instruments (TI) in the development of the semiconductor industry’s first microcontroller (MCU) utilizing the Heidenhain EnDat...
Allegro MicroSystems, LLC announces two new linear Hall-effect sensor ICs with analog output, targeted at the automotive and industrial markets. New applications...
One of the most important European research projects for energy efficiency, “eRamp”, is coming to a close. Over the past three years,...
Fuji Electric has developed a 1200V reverse-conducting (RC) IGBT based on the company’s latest thin wafer process. The 1200V RC-IGBT enables increased...
Toshiba Corporation‘s Storage & Electronic Devices Solutions Company today announced the launch of the TPD4207F, the latest addition to its line-up of...
STMicroelectronics has extended its offering of intelligent power modules with the introduction of the MOSFET-based SLLIMM-nano devices (1A and 2A current rating...
Vincotech has released the flowANPFC 0, a new symmetric PFC module aimed to help vendors step up efficiency and drive down costs....
Allegro MicroSystems Europe has announced a new gear-tooth sensor in an optimized, industry-proven, Hall- effect IC, rare-earth pellet, and high temperature ceramic...
Analog Devices, Inc. (ADI) today announced small form factor isolated gate drivers designed for the higher switching speeds and system size constraints...
Dynex Power Inc. today announced its financial results for the first quarter ended March 31st, 2017. First quarter revenue of $11.6million was...
Texas Instruments (TI) today introduced two new device families that help reduce size and weight in motor drive applications. When used together,...
During last weeks’ PCIM Europe, Vincotech announced the extension of the new industry-standard low-profile package for mid-power inverters by a sixpack configuration....
After three exhibition days, PCIM Europe in Nuremberg closed with yet another record result. More than 10,000 visitors from all over the...
STMicroelectronics has introduced new MOSFET devices in the advanced PowerFLAT™ 5×6 dual-side cooling (DSC) package, enabling increased power density in automotive Electronic...
Toshiba Corporation‘s Storage & Electronic Devices Solutions Company today announced the launch of the TLP5214A, a new smart gate driver photocoupler for...