PowerPulse.net
Motion Control
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Digital Power
Parviz Ghaffaripour Leaves Arkos Joins Exar as SVP Connectivity and Power Management
Exar Corporation announced that Parviz Ghaffaripour will join the Company as Senior Vice President of Connectivity and Power Management Products reporting to Exar President and CEO, Louis DiNardo. Mr. Ghaffaripour most recently served as CEO of Akros Silicon, a privately funded power management company located in Sunnyvale, California. Prior to Akros, he was Chief Operating […]
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Communications Power
Exar Introduces New Family of Rugged RS-485 Transceivers for the Industrial Market
Exar Corporation today announced the XR3080-88X family of high reliability RS-485/RS-422 transceivers designed for harsh industrial environments with enhanced fault and voltage protection. Consisting of nine devices, the family supports data rates up to 20Mbps in either full or half duplex configurations, and is intended for use in remote utility metering, ac and dc motor […]
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1.0KMotion ControlSingle- and Three-Phase BLDC Motor Controller
Holtek Semiconductor, Inc. has announced its new Flash type DC-Fan controller MCU, the HT66FM5230. Being specifically directed at single-phase and three-phase brushless...
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778Energy EfficiencyYokogawa Enhances Mixed-Signal Oscilloscope with Added Channels and New Firmware
The new Yokogawa DLM4000 is the industry’s first mixed-signal oscilloscope to feature eight channels. Combining the large screen and 8-channel capability of...
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1.1KComponentsAmorphous and Tape-Wound Cores, SMD Capacitors and Rugged Connectors at PCIM
AmoFlux amorphous powder cores were featured by Magnetics while VACUUMSCHMELZE GmbH & Co. KG was showing the latest developments in nanocrystalline toroidal...
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2.0KCommunications PowerSiC and GaN Again a Major Focus at PCIM Europe
Among the companies making announcements in silicon-carbide (SiC) and gallium-nitride (GaN) semiconductor devices were Toshiba Electronics Europe, ROHM, Cree, Transphorm and GaN...
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Automotive Electronics
European Project Reports Achievements in Drive to Shape the Future of Power Microelectronics
LAST POWER (Large Area silicon-carbide Substrates and heTeroepitaxial GaN for POWER device applications), the European Union-sponsored program aimed at developing a cost-effective and reliable technology for power electronics, today announced its three-year program achievements that place Europe at the forefront of research and the commercialization of energy-efficient devices for industrial and automotive applications, consumer electronics, […]
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1.2KComponentsROHM Claims New Hybrid MOS Combines the Best Characteristics of MOSFETs and IGBTs
ROHM Semiconductor claims development of a new high-voltage transistor design which was demonstrated this week at PCIM Europe and which significantly reduces...
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1.2KAutomotive ElectronicsInfineon and IR Target Automotive Systems with New Power Semis
Infineon Technologies AG and International Rectifier Corp. (IR) both launched power semiconductors qualified for use in automotive systems at this week’s PCIM...
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1.3KDigital PowerAmantys Pens Agreements with Fuji Electric, Hitachi Europe and Dynex
On the second day of PCIM Europe, Amantys Ltd. announced several important commercial developments including; the launch of two new IGBT gate...
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1.4KComponentsVincotech and Infineon Introduce New Packaging Options at PCIM Europe
Vincotech, an independent operating unit within Mitsubishi Electric Corporation, today presented a new housing size for 90° PCB mounting called flow90 0....
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Energy Efficiency
Fumihide “Humi” Esaka will Join Transphorm as CEO Starting July 1
Transphorm Inc. announced that Fumihide “Humi” Esaka will join the company as its new CEO starting July 1, 2013. Esaka is expected to play a pivotal role in Transphorm’s expansion as a worldwide leader providing GaN-based power conversion in power supplies and adapters, motor drives, solar panels, and electric vehicles. Esaka is currently CEO of […]
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1.6KCommunications PowerSiC Modules, IGBTs and Super-Junction MOSFETs Introduced on Day One of PCIM
On the opening day of PCIM Europe 2013, Cree, Inc. introduced the first-commercially available silicon-carbide (SiC) six-pack power module in a standard...
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931Batteries and Portable Power8-Bit MCUs Feature Complementary Output Generator, Op Amp and 9-bit DAC
Microchip Technology Inc. announced another expansion to the PIC16F75X family of 8-bit microcontrollers (MCUs) featuring intelligent analog and core-independent peripherals, making them...
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1.0KCommunications PowerGate Drive Optocouplers for High-Speed SiC FETs Deliver up to 2.5A
Avago Technologies today unveiled two new sets of high speed gate drive optocoupler devices, the ACPL-P/W345 and ACPL-P/W346. These devices are 1A...
