Hua Hong Semiconductor Limited and iMQ Technology Inc. announced that their jointly-developed MCUs for inverter appliances and smart meters have passed validation...
In one of its final financial reports before formally becoming part of Infineon, International Rectifier Corporation (IR) announced financial results for the first quarter ended September 28, 2014 of its fiscal year 2015, including revenue for the September quarter of $287.0 million, a 3.6% decrease compared to $297.6 million in the prior quarter and a […]
TDK Corporation presents three new series of EPCOS aluminum electrolytic capacitors with screw terminals. They are characterized by their high ripple current...
International Rectifier Corp. (IR) today announced the expansion of its StrongIRFET™ MOSFET portfolio to include 75V devices for a wide variety of...
International Rectifier Corp.(IR) announced that the company will demonstrate its industry-leading power management solutions at Electronica, Munich, November 11-14, 2014. IR’s innovative energy saving technologies and products will be on display in Hall A5, Booth 320. In addition to the latest motor control and automotive solutions, demonstrations of IR’s GaN-based power device platform, GanPowIR® will […]
Spansion Inc. today added 96 new products to the Spansion® FM4 Family of flexible microcontrollers (MCUs). Based on the ARM® Cortex®-M4F core,...
At electronica 2014 in Munich, Texas Instruments (TI) will showcase how analog and embedded processing semiconductors enable innovative technologies to meet today’s...
Exhibitors from around the world will present the latest trends and developments for energy-efficient electronic components, systems and applications at electronica from...
Texas Instruments, Inc. (TI) claims the industry’s first 24-V, sinusoidal, sensorless, brushless dc (BLDC) motor driver. The DRV10983 gives customers the ability...
Efficient Power Conversion Corporation (EPC) announce the publication of the second-edition of “GaN Transistors for Efficient Power Conversion,” a textbook written by...
Toshiba Electronics Europe (TEE) is offering two new low-profile IC output photocouplers for directly driving low- to medium-power IGBTs and power MOSFETs....
Cree, Inc. has expanded the award-winning silicon carbide (SiC) 1.2 kV six-pack power module family with a new 20A all-SiC module ideally...
Renesas Electronics Europe GmbH and its Alliance Partner port GmbH today announced efficient multi-protocol connectivity solutions for PROFINET (CCA / CCB RT1),...
The Energy Department today announced nearly $8 million to support research and development of the next generation of heating, ventilating, and air conditioning (HVAC) technologies. The R&D will focus on developing regionally appropriate HVAC solutions that would offer significant potential energy savings for new and existing buildings, and on developing innovative approaches that could replace […]
CUI Inc. has announced an addition to its next-generation modular encoder series that generates standard U/V/W commutation signals for vectoring current to...