Published December 26, 2006

3rd International Conference and Exhibition on Device Packaging

The International Microelectronics and Packaging Society presents the 3rd International Conference and Exhibition on Device Packaging from March 19 to 22 at the Doubletree Hotel in Scotsdale, Arizona.

On The Web: International Microelectronics & Packaging Society (IMAPS)

PowerPulse.net

3rd International Conference and Exhibition on Device Packaging

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