Toshiba Electronics Europe has announced a new small package size, high-current (3.3A max.) photorelay – the TLP3107. Housed in a 6.3 x 7.0mm 2.54SOP6 package, the low on-state resistance and high permissible on-state current of the TLP3107 make it suited to testing applications, including power-line switching, feedback resistance switching and measuring-line switching. It is also expected to find applications in factory automation and security systems. Photorelays provide design engineers with fast switching speed, high reliability, lower power consumption, and noise-free operation in a space-saving package, making them an alternative to mechanical relays.
Consisting of a photo MOSFET optically coupled to an infrared light emitting diode, the new photorelay utilizes the latest generation trench MOSFET to realize an approximately 1.4 times higher on-state current than Toshiba's existing product, the TLP3103. This performance, combined with a 3.3A (max.) output, will accelerate the replacement of mechanical relays in applications that require high density assembly.
Replacing a 3A-capable DIP package with the 2.54SOP6 package reduces the assembly area by 40 percent, and the overall product height by half. Other features include trigger LED current 3mA (max); off-state output terminal voltage 60V (min); and isolation voltage 1500Vrms (min).