Vincotech Expands offering to Mid-Power Inverters

Vincotech today announced the launch of a new industry-standard low-profile package for mid-power inverters. Engineered mainly for industrial drives, solar power and UPS applications, the VINco E3 package raises the performance bar with its enhanced power density and reliability.

VINco E3 features SLC (SoLid Cover) technology, which combines an insulated metal baseplate and direct potting resin to achieve both high thermal and high power cycling capability. Equipped with the latest low-loss Mitsubishi gen 7 chips, this package also achieves high power density.

The Mitsubishi gen 7 chips feature a VCEsat that is 20% lower at 150 degrees C compared with previous IGBTs. At the same Eon energy losses, the gen 7 IGBTs suppress snap-off recovery so EMC can be optimized and total system cost reduced.

Initial products in the new line will be rated for 1,200V with current ratings of 300A, 450A, 600A and 690A. The new VINco E3 line's first release is the VINcoDUAL E3 half-bridge, with built-in NTC. Sixpack and PIM configurations to follow. First engineering samples may be sourced on demand.