Every business day, PowerPulse provides readers comprehensive coverage of important New Product announcements, spanning the globe from Asia to Europe and North America. PowePulse is the most-read power electronics publication in the world because we deliver the most information to the most readers. In 2016, PowerPulse published over 2500 news stories and delivered over 12 million email updates to subscribers of PowerPulseDaily, no other publication comes close.
The following is a listing (with links for the full story) of the most-read New Product announcements on PowerPulse.Net for 2016, thus providing a window into the "pulse" of the trends and interests in the Global Power Electronics Industry. This is the final article in the series.
#10: 3500/5000 Watt 3-Phase Digital AC-DC Power Supplies
Murata has announced the D2U5T-H3-5000-380-HU3C, a highly efficient, 3500/5000 Watt, three-phase power converter for 230/480VAC systems from Murata Power Solutions. The D2U5T-H3-5000-380-HU3C power supply operates from utility-grade, three-phase ac power to deliver 5000 Watts of reliable power to 380V distributed power systems, HVDC datacenters and other industrial applications. It is provided with droop sharing to provide N+1 redundancy of supply to the application. Up to three supplies may be operated in parallel for a total system power of 15,000 Watts. More.
#9: 80V Half-Bridge 33MHz GaN FET Driver
Peregrine Semiconductor Corp. claims the world's fastest gallium nitride (GaN) field-effect transistor (FET) driver, the UltraCMOS® PE29100. Built on Peregrine's UltraCMOS technology, this new GaN driver empowers design engineers to extract the full performance and speed advantages from GaN transistors. Designed to drive the gates of a high-side and a low-side GaN FET in a switching configuration, the PE29100 claiims the industry's fastest switching speeds, shortest propagation delays and lowest rise and fall times to ac-dc converters, dc-dc converters, class D audio amplifiers and wireless charging applications. More.
#8: Low-Power Wireless Solutions for Rapid IoT Deployment
ON Semiconductor has announced two major strategic developments to enable rapid deployment of Internet of Things (IoT) solutions. Working in conjunction with SIGFOX, the world's leading provider of dedicated connectivity for the Internet of Things (IoT), ON Semiconductor has confirmed that its AX-SFEU system-on-chip (SoC) is now fully SIGFOX Readyâ„¢ certified for optimal two-way communication in Europe with certification underway for the US. More.
#7: ICs for Google's Next-Gen 48V Datacenter Architecture
STMicroelectronics announced a new family of power-conversion ICs dedicated to 48V power architectures. These three new products are shipping in volume. To meet ever-growing performance demands, servers and processors have ratcheted up their compute power—and power consumption—with multicore chips. This next-generation power architecture aims to significantly cut wasted power inside datacenter servers and it also meets the requirements of the new 48V architecture announced by Google. More.
#6: All-SiC Half-Bridge Power Module & Gate Driver Combination
Wolfspeed, A Cree Company, has introduced the first fully-qualified commercial power module from its Fayetteville, Arkansas location. The high-performance 62mm module represents a new generation of all-SiC power modules that enable unprecedented efficiency and power density for high current power electronics, such as: converters/inverters, motor drives, industrial electronics, and high performance electric vehicle systems. The new module allows systems designers to realize lighter weight systems that are up to 67% smaller by achieving efficiencies of over 98% and improvements in power density of up to 10 times compared to systems built with silicon-based technologies. More.
#5: CoolMOS CE in SOT-223 is Lower-Cost than DPAK
Infineon Technologies AG is growing the portfolio of CoolMOSâ„¢ CE with a SOT-223 package. For Infineon's CoolMOS, this package offers a cost effective alternative to DPAK as well as space savings in some designs with low power dissipation. The SOT-223 package without middle pin is fully compatible with a typical DPAK footprint and can be used as a drop-in replacement for DPAK. This new package targets customer designs in LED lighting and mobile charger applications. More.
#4: GaN Device claims Highest Efficiency at Highest Frequency
VisIC Technologies is pleased to announce availability of its new generation of ALL-Switch V22S65A (with an internal SiC diode) and V22N65A (without internal SiC diode). This new version of VisIC's ALL-Switch significantly reduces the MILLER effect enabling readily available, standard drivers to be used in VisIC-based designs. These new devices also reduce the bill of materials required for specific applications. More.
#3: Low-Profile, High-Current Power Inductors
Vishay Intertechnology, Inc. announced that it has extended its IHHP series of low-profile, high-current power inductors with two new devices in the compact 3mm by 3mm 1212 case size. Offering a wide range of inductance values from 0.33µH to 10µH and low profiles of 0.8mm and 1.0mm, respectively, the Vishay Dale IHHP-1212ZH-01 and IHHP-1212AZ-01 are designed to save space and increase efficiency in portable electronics. More.
#2: "Digitally-Wrapped" Adaptive Multi-Rail Power with Telemetry
AnDAPTâ„¢, has emerged from "stealth mode" and announced AmPâ„¢ Adaptive Multi-Rail Power Platform family, a new genre of analog power management technology heralding an innovative user paradigm for "On-Demand Power Management," and taking analog power designs to a new level of flexibility. Users can now, on-demand, select and integrate application targeted, proven Power Components on to an AmP Platform. More.
#1: 1200V SiC MOSFET with 45-milliOhm On-Resistance
Infineon Technologies AG has unveiled what is claimed to be a revolutionary silicon carbide (SiC) MOSFET technology allowing product designs to achieve previously unattainable levels of power density and performance. Infineon's CoolSiCâ„¢ MOSFETs offer a new degree of flexibility for increasing efficiency and frequency. They will help developers of power conversion schemes to save space and weight, reduce cooling requirements, improve reliability and lower system costs. More.
