Xilinx Inc. (San Jose, CA) issued a product advisory regarding defects in certain lots of its Virtex-II Pro and XC2V6000 products using flip chip packaging. The affected parts were manufactured using improper solder material that may cause random upset of device configuration, the company said in a statement.
"This issue is isolated to a limited number of parts assembled in calendar 2003, using a packing substrate from only one of our substrate vendors," the company said in the statement. "This issue has subsequently been resolved and shipments with proper solder have resumed.
Xilinx is in the process of identifying and notifying affected customers and will work on an individual basis with each customer to address their particular situations. Xilinx said the product issue would not have a material impact on the December 2003 quarter or March 2004 quarter financial results.
