Components

Two EasyPACK™ Modules with CoolSiC™ MOSFETs for EV Charging and UPS

Production numbers of electric vehicles (full and hybrid) are rapidly increasing. With that, the demand for energy efficient charging solutions is also rising. Addressing the fast-growing demand for Silicon Carbide (SiC) solutions in this field, Infineon Technologies AG has launched two new EasyPACK modules of the 1200V family. Both, Easy 1B and Easy 2B, integrate CoolSiC™ MOSFETs aiming not only at this market but also at UPS applications.

Coming in two different topologies the power modules enable engineers to increase their systems’ efficiency for reduced cooling effort. In addition, higher frequency operation is possible. Integrated in an Easy 1B housing (pictured above) the four-pack topology (F4-23MR12W1M1_B11) targets the dc-dc stage of the charging station.

EasyPACK™ 1B 1200V / 23mΩ four-pack module with CoolSiC™ MOSFET, NTC and PressFIT contact technology, summary of features:

  • High current density
  • Best in class switching and conduction losses
  • Low inductive design
  • Integrated NTC temperature sensor
  • PressFIT contact technology
  • RoHS-compliant modules

The Easy 2B (F3L15MR12W2M1_B69) holds a three-level configuration that is well-suited for the Vienna Rectifier usually implemented in this application for the PFC stage. In combination, the power modules can be used for 50/60 kW EV charging solution.

EasyPACK™ 2B

EasyPACK™ 2B is a 1200V, 15mΩ 3-Level module with CoolSiC™ MOSFET, NTC temperature sensor and PressFIT contact technology, summary of features:

  • High current density
  • Best in class switching and conduction losses
  • Low inductive design
  • RoHS-compliant modules

The EasyPACK standard package for power modules is characterized by an industry-leading low stray inductance. This helps in building up stacked modular solutions for charging which can go up to 120/150 kW. The NTC temperature sensor, which is also featured in the Easy modules, facilitates the monitoring of the device, while the PressFIT technology reduces assembly time for mounting the device.

Availability

Both Easy CoolSiC MOSFETs can be ordered now.

Infineon Technologies AG
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