Small Footprint AEC-Q100 Logic Solutions with Performance of Leaded Equivalents

Nexperia announced that over twenty logic types in the company’s space-saving leadless MicroPak packages are now AEC-Q100 qualified. The company claims that these logic solutions are the smallest devices of their type suitable for automotive applications and that its Q100 portfolio exceeds the Automotive Electronics Council’s requirements

In addition to automotive applications, the logic solutions are suitable for space constrained designs, consumer electronics, as well as portable and mobile devices.

Nexperia’s MicroPak packages feature the same silicon die as larger PicoGate options, ensuring that electrical performance remains identical to leaded equivalents. MicroPak packages save up to 64% PCB space compared to leaded equivalents. The twenty logic solutions come in 6-pad XSON6 and 8-pad XSON8. The packages also provide a more reliable bond between device and board, thanks to a higher pad size-to-package footprint ratio.

“These are the smallest logic parts qualified for the automotive industry. Applications include in-car entertainment and ADAS where miniaturization is of paramount importance,” Ghislaine Jilisen-Janssen, Product Manager for Mini Logic, observed.

Nexperia’s logic solutions are available immediately in the company’s automotive portfolio including low-power, single-gate, and dual-gate functions in AUP (0.8V to 3.6V), AVC (1.2V to 3.6V) and LVC (1.65V to 5.5V) technologies, ranging from gates to translators.

Nexperia says it can also release devices from its MicroPak offering for automotive applications upon request.

Key features and benefits
  • Very small footprint
  • 0.5mm, 0.35mm, and 0.30mm pitch options
  • Low profile height (0.5mm or 0.35mm)
  • Leadless, no bent leads
  • No co-planarity issues
  • Pb-free, RoHS and dark green compliant
  • Temperature range -40°C to 125°C
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