Components

18mm x 18mm SiP for IoT, Sensors, and Motor Control

Octavo Systems introduced the OSD32MP1, their first System-in-Package (SiP) product based on the new STM32MP1 microprocessor from STMicroelectronics. The device is up to 64% smaller than an equivalent system made from discrete components. At 18mm X 18mm the OSD32MP1 is the same size as the STM32MP1 but it integrates the STM32MP1, DDR, PMIC, EEPROM, oscillators, and passives into a single BGA package that is 18mm X 18mm.

A wide range of peripherals including two 22 Channel ADCs, a camera interface, 1Gbps ethernet, and a 3D GPU make it suitable for remote sensors, HMI displays, motor control applications, medical systems, and IoT endpoints. The integration also makes the solution fit any application needing a versatile applications processor in a small package.

At only 18mm on a side, the OSD32MP1 packs an entire STM32MP1 system in a package the same size as the processor itself saving designers up to 64% in PCB area. (See size comparison below).

Integrated Components
  • STMicroelectronics STM32MP1 microprocessor
  • STPMIC1 Power Management IC (PMIC)
  • Up to 1GB of DDR3 memory
  • 4K non-volatile EEPROM
  • MEMs oscillators
  • Over 100 passives
  • All into a single BGA package.
  • The new STM32MP1 contains Dual Arm® Cortex®-A7 microprocessors along with an Arm® Cortex®-M4 microcontroller.

The OSD32MP1 integration lets users take advantage of a full microprocessor without increasing the complexity that typically comes from routing DDR and power management.

Beyond simplifying the design process, the OSD32MP1 brings all the other benefits of SiP to this new set of designs. These benefits include lower cost PCBs resulting from less required space and a less complicated manufacturing processes, like Laser Vias or Via-in-Pad. The OSD32MP1 also simplifies the task of sourcing components by integrating over 100 devices from multiple vendors into a single component.

The OSD32MP1 lets users of the popular STM32 family move to Linux without increasing the size or complexity of their design. The STM32MP1 builds on the success of the STM32 line of microcontrollers by leveraging the STM32 Cube Environment. The inclusion of the M4 allows full reuse of the STM32 MCU Cube Firmware while adding support for Linux.

According to Octavo, the ability to reuse firmware and reduce complexity makes the OSD32MP1 the easiest path for designers to move from a microcontroller to Linux.

“The continued push of IoT and the demand for more data has required many applications to migrate from an existing microcontroller design to one based on a microprocessor running Linux. There are usually two major hurdles that prevent this from being an easy transition; porting their application, and complicated hardware designs,” comments Greg Sheridan, Marketing Manager at Octavo Systems. “Integrating the new STM32MP1 into the OSD32MP1 removes these roadblocks, greatly reducing the effort required to migrate from a microcontroller to a microprocessor running Linux.”

“Having ST ask us to be one of their partners at launch really validates our vision for the future of electronics design. Designers will demand more integrated solutions to start to develop their unique applications faster rather than spend time on tedious tasks that don’t differentiate their product,” adds Gene Frantz, CTO Octavo Systems. “System-in-Package is the solution to provide this tremendous level of integration.”

Design resources for the OSD32MP1 are available on the Octavo Systems website. Samples will be available in Q3 with full production scheduled for Q4. “Pricing is still being finalized and will be in-line with the cost of an equivalent system designed with discrete components,” said Greg.

Octavo Systems , STMicroelectronics NV
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