TDK Corporation has announced RoboKit, a new development kit that enables seamless integration of solutions from TDK’s portfolio designed for the robotics market. RoboKit integrates key TDK offerings such as InvenSense ICM-42688-P 6-axis inertial measuring unit (IMU), InvenSense ICP-10111 capacitive barometric pressure sensor, InvenSense ICS-43434 multi-mode digital microphone, Chirp CH-101 and CH-201 ultrasonic ToF sensors, and Micronas motor controller, angle sensor, and position sensors.
The TDK RoboKit is available to select early partners and customers. General availability is expected in second half of 2020.
The robotics market is one of the seven key market segments of TDK, with a dominant footprint in typical robotic systems such as sensors, controllers, batteries, and components. TDK delivers solutions that meet the rigorous demands of the robotics market, such as heading accuracy of under 10 degrees per hour using InvenSense IMUs and RoboVac software, market-ready inertial navigation system (INS) from Coursa Drive, robust obstacle detection for any color objects in all lighting conditions using Chirp ultrasonic ToF sensor, in addition to robot joint control using Micronas motor controllers. Also included are a temperature sensor and magnetometer.
Additionally, the TDK RoboKit software integrates with the leading robotic operating system, ROS. ROS-ready drivers for IMU and ultrasonic range sensor are available now.
TDK and Qualcomm Technologies also announced the compatibility of TDK RoboKit with the Qualcomm® Robotics RB3 platform. Fundamental to every type of robot are three operations: sensing, thinking, and acting. With TDK providing the “sensing” and “acting” operations through its extensive portfolio of sensors and software, and Qualcomm Technologies enabling the “thinking” operation through the power and performance of the Qualcomm® SDA845 processor, the TDK RoboKit platform offers seamless integration for development and support across multiple robotics applications.
“Together, Qualcomm Technologies and TDK continue to drive cutting edge innovation and ever-greater performance for the robotics industry,” said Dev Singh, Senior Director, Business Development and Head of Robotics, Qualcomm Technologies, Inc. “We have seen tremendous success with the release of the Qualcomm Robotics RB3 platform, and look forward to many more collaborations with TDK in this space.”
“With the RoboKit, the developer community can focus on building robots for specific use cases,” said Rahul Bakshi, Senior Director Software Engineering, InvenSense, Inc, A TDK Group Company . “The Qualcomm Robotics RB3 platform in combination with our TDK RobotKit can provide developers with TDK’s best-in-class sensor hardware and fusion algorithms along with the Qualcomm® Artificial Intelligence Engine for delivering unparalleled performance in critical functions in robotic systems, such as object detection, crash avoidance, and navigation.”
“We’re happy to see TDK work to officially support the RoboKit with The Robot Operating System,” said Brian Gerkey, CEO, Open Robotics. “This focus will help make it easier for the ROS community to leverage this technology and expand their capabilities.”
TDK will demonstrate the TDK RoboKit and representative use cases such as flooring type detection for robotic vacuum cleaner, along with the industry’s most comprehensive portfolio of passive components, sensors, power supplies and batteries, at CES 2020, booth #11448 in Central Hall, Las Vegas Convention Center, January 7-10, 2020 in Las Vegas.