Nano Dimension announced that its subsidiary, Nano Dimension Technologies, has developed a technology for the printing of 3D objects, which includes electronic conductors. The company has developed an innovative approach to print objects in 3D that contain conductive traces – a patent-pending technology. Nano Dimension was able to make this new technological development as a result of its work developing materials and 3D printers for multilayer PCB prototyping.
The sintering of a printed metal conductor within a 3D printed polymer allows for complex connectors to be 3D printed and also makes it possible to 3D print molded connectors directly onto electronic circuits. The newly developed process may also be applied to 3D printing of non-flat electronic circuits as well as structural objects with embedded electronic circuits.
The materials and processes required for 3D printing objects containing semiconductors may result in a significant breakthrough for the industry, enabling the creation of freeform electronic products that cannot be created using current circuit manufacturing technologies.
Commenting on an earlier announcement, Amit Dror, Nano Dimension Cofounder and CEO said: "Multilayer, 3D inkjet PCB printing is an entirely new category of 3D printing designed specifically for the production of professional multilayer PCBs, and it eliminates the negative issues associated with outside manufacturing facilities. With Nano Dimension's DragonFly 2020 3D Printer a world's first for printing multilayer circuit boards, users can build functional prototypes in-house (including the interconnections between layers) in a matter of hours."