Matsushita Electric Industrial Co. Ltd. (Osaka, Japan) announced the ERTJZE Series of multilayer chip thermistors, which are offered in a 0201 case size and provide up to about 60 percent size reduction compared to 0603 devices. Employing a proprietary lead-free plating technology, the thermistors deliver high mounting reliability and durability.
The devices are intended for modules for cellular phones such as battery-pack charging control and TCXO temperature-compensation applications, and are specified with zero-power resistances of 30 ohms to 150 ohms (2,750 B-value) and 1.5 ohms to 4.7 kiloohms (4,500 B-value). They operate from -40 to 125 degrees C, and withstand 270 degrees C (±5 degrees C) soldering heat for 3s (±0.5s).
