Kyocera Corporation and Vicor Corporation reported that they will collaborate on next-generation Power-on-Package (PoP) solutions to maximize performance and minimize time-to-market for emerging processor technologies.
As a part of the collaboration, Kyocera will provide the integration of power and data delivery to the processor with module substrates, organic packages, and motherboard designs. Vicor will provide Power-on-Package current multipliers that enable high density, high current delivery to processors.
This collaboration intends to address the rapid growth of higher performing processors, which has lead to proportionate growth and complexity in high-speed I/Os and high current consumption demands.
Vicor’s Power-on-Package technology enables current multiplication within the processor package, allowing for higher efficiency, density, and bandwidth. Providing current multiplication within the package can reduce interconnect losses by up to 90 percent, according to Vicor. This integrated current multiplication functionality allows processor package pins, typically required for high current delivery, to be reclaimed for expanded I/O functionality.
The Vicor advanced Power-on-Package technology enables Vertical Power Delivery (VPD) from the bottom side of the processor. VPD virtually eliminates Power Delivery Network (PDN) losses while maximizing I/O capability and design flexibility.
Kyocera’s proprietary solutions optimize processor performance and reliability based on the company’s decades of experience in package, module and motherboard manufacturing.
Kyocera has cultivated design expertise by applying Vicor’s Power-on-Package devices in several applications. By employing its design technology, simulation tools, and taking advantage of its manufacturing experience, Kyocera offers designs for complex I/O routing, high-speed memory routing, and high-current power delivery. Through the collaboration, Kyocera and Vicor will develop new solutions for Artificial Intelligence (AI) and high-performance processor applications to market.