New Industry Products

IXYS Expands Its SMPD Products for Motor Drives, UPS and Inverters

June 14, 2012 by Jeff Shepard

IXYS Corp. announced that it is extending the Surface Mount Power Device (SMPD) range to include products that provide the essential building blocks of the power semiconductors for power electronic motor drive systems, the inverter for power supplies and UPS, and the power stage for micro inverters and inverters.

The IXYS SMPD, which has been in volume production since its introduction a year ago, is an innovative power module which can be easily surface mounted on a Printed Circuit Board (PCB) using standard pick and place and reflow soldering process. It is a preferable automated PCB assembly process for the industry without costly screws, cables, bus-bars or hand soldered contacts that have been used for standard power modules in the past. Additionally, these products are much lighter in weight than comparable standard power modules.

"Since its inception the SMPD has proved extremely attractive to our customers who needed a better power module solution for automated SMD assembly because it is a lower weight, lower cost, smaller sized package - ’MORE POWER, LESS PACKAGE’. Using our proprietary highly thermally efficient substrate technology, we can build any power circuit on it with full electrical isolation. We provide full design flexibility to our customers. We can use all our silicon technologies - rectifiers, thyristors, MOSFETs, XPT IGBTs, reverse blocking IGBTs and SiC diodes in any desired configurations," commented Mr. Bradley Green, President of European Sales and Business Development at IXYS.

This new range of products is targeted to provide SMPD modules for each of the rectifier, brake and inverter stages of a motor drive or micro-inverter system which can be located separately on the PCB to facilitate reduced heat sink size, weight and cost. The SMPD advantage allows faster assembly cycles and the chip scale packaging reduces material waste inherent in single module solutions.

"Our ’MORE POWER, LESS PACKAGE’ design philosophy is targeted to make use of leading edge material technology to improve our customers’ solutions in a world more sensitive to the environmental impact of product design. By lowering the weight significantly, typically by 50%, we help reduce the carbon footprint for our customers who are using this family of SMPD products," added Mr. Green.

By using a simple combination of products, a motor drive system or micro-inverter with optimized silicon content up to 11kW in power rating can be achieved with a faster time to market and minimal investment due to standard surface mount assembly processes currently existing in normal PCB assembly lines.

More news and information regarding the latest developments in Smart Grid electronics can be found at Darnell’s SmartGridElectronics.Net.