International Rectifier (IR, El Segundo, CA) recently introduced the IRF5810, a dual MOSFET housed in a TSOP-6 package. The new device combines two P-channel HEXFET power MOSFETs into a single 1.3 x 2.9mm footprint, reducing the MOSFET part count and the footprint in half. Each MOSFET in the package performs at 90mOhms Rds(on), 40 percent lower than competing dual MOSFETs in the TSOP-6 package, according to IR.
IR states that designers can replace two single TSOP-6 load switches with one IRF5810. The new device is also claimed to reduce pick and place cost and improve manufacturing throughput. Applications include load an dbattery management circuits in cell phones, PDAs, MP3 players, notebook computers and PCMCIA cards.
"The IRF5810 is ideal in portable electronics applications when printed circuit board space is limited and maximum functionality is required," stated Shawn O'Grady, IR technical marketing manager for portable products. "It is tailored for the smallest applications, while satisfying performance requirements. We believe the IRF5810 is the industry's best-performing dual MOSFET in the TSOP-6 package for portable applications on the market."
An extended leadframe maximizes the size of each die in the TSOP-6outline, increasing current capability and on-state efficiency. A single IRF5810 can replace two TSOP-6 devices in load management circuits, or a larger TSSOP-8 packaged dual MOSFET in battery management circuits, according to IR.
The new IRF5810 dual MOSFETs are available now in prices of $0.35 each in 10,000-unit quantities.
