New Industry Products

Infineon Technologies Introduces TSLP Packaging Technology

March 07, 2001 by Jeff Shepard

Infineon Technologies (Germany) introduced a new packaging technology called the Thin Small Lead-less Package (TSLP). Infineon's TSLP is a plastic, lead-less, halogen-free package for discrete devices which, the company claims, consumes only 20 percent of the space of a standard SC-75 package. With an overall footprint of 1.0mm x 0.6mm x 0.4mm, the TSLP is compatible with existing pick-and-place equipment and PCB insertion techniques.

Infineon is now offering a variety of diodes and transistors in this new TSLP-2/3 (2/3-pin). The new package is suitable for wireless systems, GSM phones, personal digital assistants, digital cameras and portable digital audio/video players.

High-volume production of devices using the TSLP will commence in April 2001. Future chip scale plans based on the TSLP concept include dual diodes, dual transistors and small-scale integrated semiconductors.