Integrated Device Technology, Inc. and Telink Semiconductor, a fabless IC design firm, announced a partnership to develop connected and integrated sensor platforms for IoT applications. These platforms enable a wide range of IoT use cases, including connected smart buildings, environmental sensing, health and fitness monitoring, as well as asset identification, and position and location tracking.
IDT plans to release the new Bluetooth Low Energy 5 module featuring Telink's 32-bit microcontroller core with enhanced power-balanced performance for battery-operated devices. An integrated 2.4GHz RF transceiver supports the IEEE802.15.4 multi-standard wireless protocol along with audio.
"We are excited about Telink's technology and how it will augment our existing sensor technology and connectivity platform," said Sailesh Chittipeddi, IDT's executive vice president for global operations and chief technology officer. "With this partnership, we will be able to address markets together that we weren't fully capable of with our standalone solutions."
"IDT's integrated sensors and applications combined with Telink's third generation, ultra-low power connectivity ICs - specifically designed to enable cost sensitive applications - give high-performance options without compromise to connected sensing product designers," said Jim Wargnier, global VP of sales for Telink Semiconductor. "We look forward to pushing the boundaries with IDT on this exciting platform."
IDT's sensor platform with Bluetooth® is sampling in Q1 2019 With integrated high-performance, low-power connectivity powered by Telink Semiconductor.
