Packaging and Cooling

High-Current Interconnects for Damage-Free Pin-to-Socket Axial Mating

Molex offers the innovative Coeur CST High-Current Interconnect System featuring a unique new float design that accommodates pin to socket misalignment allowing for ease of mating PCB to PCB, PCB to bus bar, or bus bar to bus bar without the risk of overstress damage to the socket contact system.

"It is difficult to have perfect pin-to-socket alignment when mating two rigid PCBs or bus bars. In the Coeur CST High-Current Interconnect System, our design allows for the entire core socket assembly to move within an outer housing, preventing potential overstress damage to the contacts," said Jeff Gaumer, global product manager, Molex. "This makes Coeur CST ideal for applications where the need for float is critical for Power Distribution mechanical packaging."

In addition to this unique float design providing 1.00mm of axial float, the Coeur CST High-Current Interconnect System is also compact in size allowing for a mated board-to-board profile as low as 5.00mm that doesn't require a large protrusion above or below the mated boards. The system also offers sockets with or without the float feature.

The flexible, scalable Coeur CST High-Current Interconnect System delivers between 30.0A and 200.0A of current and offers a wide range of configurations to accommodate PCB, bus bar, and wire solutions.

Multiple contact beams optimize electrical performance. The same common contact design is used on all CST form factor sockets (3.40, 6.00, and 8.00mm).

The wire-to-board and wire-to-wire Coeur CST solutions will include male and female crimp contacts, single and multi-row housings with features such as touch safe, mate-first-last-break option, positive latching, panel-mount options, vertical and right-angle configurations, and PCB and bus bar mounting header options.

Molex Inc.
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