Fairchild Semiconductor International (South Portland, ME) introduced its new dual n-channel FDC6000NZ MOSFET device that combines Fairchild’s PowerTrench® MOSFET silicon technology with a SuperSOT™-6 flipchip in a leaded molded package. The MOSFET power switch in a low-profile (0.8 mm maximum height), small footprint (9.0 mm² maximum area) package provides the electrical and thermal performance critical to lithium-ion battery pack protection. The solution is suitable for a wide variety of mobile communications products, including mobile handsets, PDAs, portable music players, digital cameras, palmtop computers and GPS receivers.
The FDC6000NZ achieves power dissipation of 1.6 W, and a maximum steady-state current of 7.3 A, while providing a 55-percent footprint area reduction and a 27-percent profile reduction over the TSSOP-8 package. The FDC6000NZ limits switching losses and provides a low-voltage drop solution for new charger/battery pack system design requirements.
The lead-free product meets or exceeds the requirements of the joint IPC/JEDEC standard J-STD-020B, and is compliant with the European Union requirements, which will take effect in 2005. UL and VDE safety approvals are pending. Available now, pricing for the FDC6000NZ is $0.66 each in 1,000-piece quantities. Delivery is eight weeks ARO.
